JPS579866A - Electroless copper plating solution - Google Patents
Electroless copper plating solutionInfo
- Publication number
- JPS579866A JPS579866A JP8291480A JP8291480A JPS579866A JP S579866 A JPS579866 A JP S579866A JP 8291480 A JP8291480 A JP 8291480A JP 8291480 A JP8291480 A JP 8291480A JP S579866 A JPS579866 A JP S579866A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- plating soln
- electroless copper
- plating
- ion complexing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To improve the stability of an electroless copper plating soln. without exerting disadvantageous influence on the deposition speed and the physical properties of a film by adding a monovalent copper chelating agent contg. a nitrogen ring to the plating soln.
CONSTITUTION: This electroless copper plating soln. is prepared by blending water with water-soluble copper salt, a divalent copper ion complexing agent, a pH regulator, a copper ion reducing agent and ≥1 kinds of cuprous ion complexing agents such as ethylenediamine tetraacetates represented by formula I, II, III (where X in -N-, X' is -NH- or -CH2- and each of R and R' is -(CH2)2-, -CH=CH-, -N= N- or the like). The cuprous ion complexing agents are added alone or after mixing with a nonionic surfactant. By this composition the plating speed and the physical and mechanical properties of a plated film and enhanced, and the stability of the plating soln. is ensured.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8291480A JPS579866A (en) | 1980-06-20 | 1980-06-20 | Electroless copper plating solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8291480A JPS579866A (en) | 1980-06-20 | 1980-06-20 | Electroless copper plating solution |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS579866A true JPS579866A (en) | 1982-01-19 |
Family
ID=13787512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8291480A Pending JPS579866A (en) | 1980-06-20 | 1980-06-20 | Electroless copper plating solution |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS579866A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6021383A (en) * | 1983-07-12 | 1985-02-02 | C Uyemura & Co Ltd | Method for chemically plating copper |
US5059243A (en) * | 1989-04-28 | 1991-10-22 | International Business Machines Corporation | Tetra aza ligand systems as complexing agents for electroless deposition of copper |
JP2014043412A (en) * | 2012-08-27 | 2014-03-13 | Shikoku Chem Corp | 4-naphthyl imidazole compound and antioxidant |
-
1980
- 1980-06-20 JP JP8291480A patent/JPS579866A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6021383A (en) * | 1983-07-12 | 1985-02-02 | C Uyemura & Co Ltd | Method for chemically plating copper |
JPH0222151B2 (en) * | 1983-07-12 | 1990-05-17 | Uemura Kogyo Kk | |
US5059243A (en) * | 1989-04-28 | 1991-10-22 | International Business Machines Corporation | Tetra aza ligand systems as complexing agents for electroless deposition of copper |
JP2014043412A (en) * | 2012-08-27 | 2014-03-13 | Shikoku Chem Corp | 4-naphthyl imidazole compound and antioxidant |
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