JPS5794589A - Rapid electroplating bath and method - Google Patents

Rapid electroplating bath and method

Info

Publication number
JPS5794589A
JPS5794589A JP56163363A JP16336381A JPS5794589A JP S5794589 A JPS5794589 A JP S5794589A JP 56163363 A JP56163363 A JP 56163363A JP 16336381 A JP16336381 A JP 16336381A JP S5794589 A JPS5794589 A JP S5794589A
Authority
JP
Japan
Prior art keywords
electroplating bath
rapid electroplating
rapid
bath
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56163363A
Other languages
Japanese (ja)
Other versions
JPS6020475B2 (en
Inventor
Aaru Roozuguren Donarudo
Jiei Meiyaa Rinda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Occidental Chemical Corp
Original Assignee
Hooker Chemicals and Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals and Plastics Corp filed Critical Hooker Chemicals and Plastics Corp
Publication of JPS5794589A publication Critical patent/JPS5794589A/en
Publication of JPS6020475B2 publication Critical patent/JPS6020475B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Cosmetics (AREA)
JP56163363A 1980-10-23 1981-10-13 High-speed electroplating bath and plating method Expired JPS6020475B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19989480A 1980-10-23 1980-10-23
US199894 1980-10-23

Publications (2)

Publication Number Publication Date
JPS5794589A true JPS5794589A (en) 1982-06-12
JPS6020475B2 JPS6020475B2 (en) 1985-05-22

Family

ID=22739453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56163363A Expired JPS6020475B2 (en) 1980-10-23 1981-10-13 High-speed electroplating bath and plating method

Country Status (15)

Country Link
JP (1) JPS6020475B2 (en)
AU (1) AU527954B2 (en)
BE (1) BE890836A (en)
BR (1) BR8106819A (en)
CA (1) CA1180677A (en)
CH (1) CH649579A5 (en)
DE (1) DE3139641C2 (en)
DK (1) DK422181A (en)
ES (1) ES8302802A1 (en)
FR (1) FR2492849A1 (en)
GB (1) GB2085924B (en)
HK (1) HK66786A (en)
IT (1) IT1171598B (en)
NL (1) NL8104808A (en)
SE (1) SE8106250L (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007119902A (en) * 2005-09-27 2007-05-17 Hitachi Cable Ltd Nickel plating solution and its preparation method, nickel plating method, and printed wiring board copper foil

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1162505A (en) * 1980-10-31 1984-02-21 Donald R. Rosegren Process for high speed nickel and gold electroplate system
US4543166A (en) * 1984-10-01 1985-09-24 Omi International Corporation Zinc-alloy electrolyte and process
KR102281132B1 (en) * 2019-10-24 2021-07-26 일진머티리얼즈 주식회사 Electrolytic Nickel Foil for Thin Film-type Capacitor and Production Method of the Same
CN112323096A (en) * 2020-09-23 2021-02-05 河北东恩企业管理咨询有限公司 Preparation method of sulfur-nickel-containing round cake

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334032A (en) * 1964-05-08 1967-08-01 Hanson Van Winkle Munning Co Electrodeposition of nickel
US3697391A (en) * 1970-07-17 1972-10-10 M & T Chemicals Inc Electroplating processes and compositions
ZA721964B (en) * 1971-04-01 1972-12-27 M & T Chemicals Inc Nickel plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007119902A (en) * 2005-09-27 2007-05-17 Hitachi Cable Ltd Nickel plating solution and its preparation method, nickel plating method, and printed wiring board copper foil

Also Published As

Publication number Publication date
HK66786A (en) 1986-09-18
CA1180677A (en) 1985-01-08
FR2492849A1 (en) 1982-04-30
DE3139641C2 (en) 1986-07-31
BR8106819A (en) 1982-07-06
DK422181A (en) 1982-04-24
GB2085924A (en) 1982-05-06
ES506173A0 (en) 1983-01-16
NL8104808A (en) 1982-05-17
FR2492849B1 (en) 1984-11-23
BE890836A (en) 1982-04-22
IT1171598B (en) 1987-06-10
DE3139641A1 (en) 1982-09-30
IT8149529A0 (en) 1981-10-21
AU527954B2 (en) 1983-03-31
CH649579A5 (en) 1985-05-31
GB2085924B (en) 1983-06-02
AU7567681A (en) 1982-04-29
JPS6020475B2 (en) 1985-05-22
ES8302802A1 (en) 1983-01-16
SE8106250L (en) 1982-04-24

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