JPS5787324A - Adhesion of copper foil and resin substrate - Google Patents

Adhesion of copper foil and resin substrate

Info

Publication number
JPS5787324A
JPS5787324A JP16236780A JP16236780A JPS5787324A JP S5787324 A JPS5787324 A JP S5787324A JP 16236780 A JP16236780 A JP 16236780A JP 16236780 A JP16236780 A JP 16236780A JP S5787324 A JPS5787324 A JP S5787324A
Authority
JP
Japan
Prior art keywords
copper foil
resin substrate
adhesion
coupling agent
silane coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16236780A
Other languages
Japanese (ja)
Other versions
JPS6015654B2 (en
Inventor
Takeshi Yamagishi
Kazuyoshi Aso
Kazuo Yajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIHON DENKAI KK
Nippon Denkai Co Ltd
Original Assignee
NIHON DENKAI KK
Nippon Denkai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIHON DENKAI KK, Nippon Denkai Co Ltd filed Critical NIHON DENKAI KK
Priority to JP16236780A priority Critical patent/JPS6015654B2/en
Publication of JPS5787324A publication Critical patent/JPS5787324A/en
Publication of JPS6015654B2 publication Critical patent/JPS6015654B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Abstract

PURPOSE: To obtain firm adhesion simply, by treating the adhesion surface of either copper foil or the resin substrate with the solution of specified silane coupling agent, then adhering them.
CONSTITUTION: When adhering the copper foil and the resin substrate, the rough surface of the copper foil or the chromate treated layer is treated with the solution of silane coupling agent (e.g. γ-chloropropyl-trimethoxysilane) expressed in formula YRSiX3 (Y, functional radical reactive with high polymer; R, coupling radical connecting Y and silicon atom which contains aliphatic or aromatic hydrocarbon; X, organic or inorganic hydrolyzable radical which combines with silicon atom), then adhered to the resin substrate. Otherwise, the unhardened resin substrate is beforehand impregnated with silane coupling agent expressed in the formula and adhered to the rough surface of the copper foil or the chromate treated layer formed on this surface.
COPYRIGHT: (C)1982,JPO&Japio
JP16236780A 1980-11-18 1980-11-18 Adhesion method for chromate treated layer of copper foil and resin base material Expired JPS6015654B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16236780A JPS6015654B2 (en) 1980-11-18 1980-11-18 Adhesion method for chromate treated layer of copper foil and resin base material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16236780A JPS6015654B2 (en) 1980-11-18 1980-11-18 Adhesion method for chromate treated layer of copper foil and resin base material

Publications (2)

Publication Number Publication Date
JPS5787324A true JPS5787324A (en) 1982-05-31
JPS6015654B2 JPS6015654B2 (en) 1985-04-20

Family

ID=15753213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16236780A Expired JPS6015654B2 (en) 1980-11-18 1980-11-18 Adhesion method for chromate treated layer of copper foil and resin base material

Country Status (1)

Country Link
JP (1) JPS6015654B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140051A (en) * 1983-01-31 1984-08-11 松下電工株式会社 Manufacture of metallic foil lined laminated board
JPS6392090A (en) * 1986-10-06 1988-04-22 三井金属鉱業株式会社 Manufacture of multilayer circuit board
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
EP0576942A2 (en) * 1992-06-24 1994-01-05 Trautwein GmbH & Co Plate protected against duplication and/or unauthorised removal and reutilisation
US5709957A (en) * 1994-04-22 1998-01-20 Gould Electronics Inc. Metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer
JP2005139458A (en) * 2003-11-10 2005-06-02 General Electric Co <Ge> Method for enhancing bonding of epoxy to gold surface
CN102459703A (en) * 2009-06-05 2012-05-16 吉坤日矿日石金属株式会社 Copper foil for semiconductor package substrate and subsrate for semiconductor package
JP2012111980A (en) * 2010-11-19 2012-06-14 Hitachi Cable Ltd Copper foil for printed circuit board, and printed circuit board
US9580829B2 (en) 2010-05-07 2017-02-28 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8642893B2 (en) 2007-09-28 2014-02-04 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit and copper-clad laminate
JP5654416B2 (en) 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 Liquid crystal polymer copper clad laminate and copper foil used for the laminate
TWI592293B (en) 2012-03-29 2017-07-21 Jx Nippon Mining & Metals Corp Surface treatment of copper foil
CN104246013B (en) * 2012-03-29 2018-01-23 Jx日矿日石金属株式会社 Surface treatment copper foil
JP5823005B1 (en) * 2014-08-29 2015-11-25 Jx日鉱日石金属株式会社 Method for producing copper foil with carrier, method for producing copper clad laminate, method for producing printed wiring board, electronic device and copper foil with carrier
JP6073947B2 (en) * 2015-03-09 2017-02-01 Ｊｘ金属株式会社 Copper foil with carrier, method for producing copper-clad laminate, method for producing printed wiring board, and method for producing electronic device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140051A (en) * 1983-01-31 1984-08-11 松下電工株式会社 Manufacture of metallic foil lined laminated board
JPH0373458B2 (en) * 1983-01-31 1991-11-21 Matsushita Electric Works Ltd
JPS6392090A (en) * 1986-10-06 1988-04-22 三井金属鉱業株式会社 Manufacture of multilayer circuit board
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
EP0576942A2 (en) * 1992-06-24 1994-01-05 Trautwein GmbH &amp; Co Plate protected against duplication and/or unauthorised removal and reutilisation
EP0576942A3 (en) * 1992-06-24 1997-06-11 Trautwein Gmbh & Co Plate protected against duplication and/or unauthorised removal and reutilisation
CN1088006C (en) * 1994-04-22 2002-07-24 古尔德电子有限公司 Metallic body with vapor deposited treatment layer(s) and adhesion-promoting layer
US6248401B1 (en) 1994-04-22 2001-06-19 Shiuh-Kao Chiang Process for treating a metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer
US5709957A (en) * 1994-04-22 1998-01-20 Gould Electronics Inc. Metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer
JP2005139458A (en) * 2003-11-10 2005-06-02 General Electric Co <Ge> Method for enhancing bonding of epoxy to gold surface
CN102459703A (en) * 2009-06-05 2012-05-16 吉坤日矿日石金属株式会社 Copper foil for semiconductor package substrate and subsrate for semiconductor package
KR101327565B1 (en) * 2009-06-05 2013-11-12 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Copper foil for semiconductor package substrtate and subsrate for semiconductor package
TWI645073B (en) * 2009-06-05 2018-12-21 Ｊｘ日鑛日石金屬股份有限公司 Copper foil and semiconductor package substrate
US9580829B2 (en) 2010-05-07 2017-02-28 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit
US10472728B2 (en) 2010-05-07 2019-11-12 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit
JP2012111980A (en) * 2010-11-19 2012-06-14 Hitachi Cable Ltd Copper foil for printed circuit board, and printed circuit board

Also Published As

Publication number Publication date
JPS6015654B2 (en) 1985-04-20

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