JPS5763212A - Molding die - Google Patents

Molding die

Info

Publication number
JPS5763212A
JPS5763212A JP13847880A JP13847880A JPS5763212A JP S5763212 A JPS5763212 A JP S5763212A JP 13847880 A JP13847880 A JP 13847880A JP 13847880 A JP13847880 A JP 13847880A JP S5763212 A JPS5763212 A JP S5763212A
Authority
JP
Japan
Prior art keywords
seal
cavity
outside
seal member
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13847880A
Other languages
Japanese (ja)
Inventor
Kunihito Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13847880A priority Critical patent/JPS5763212A/en
Publication of JPS5763212A publication Critical patent/JPS5763212A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To accomplish a resin sealing free of burr by bulging a seal member outside a groove for retaining an expansible and reducible seal member formed outside a cavity at die joint surface in the molding.
CONSTITUTION: A groove for housing a seal member is formed outside a cavity 5 at a die joint surface A or outside the cavity and an injected resin passage and a hollow seal material 9 is inserted thereinto. After the clamping of the die, a fluid is forced into the seal material 9 and expanded until the seal presses against the surface and the back of an IC frame 3 to seal it airtight.
COPYRIGHT: (C)1982,JPO&Japio
JP13847880A 1980-10-02 1980-10-02 Molding die Pending JPS5763212A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13847880A JPS5763212A (en) 1980-10-02 1980-10-02 Molding die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13847880A JPS5763212A (en) 1980-10-02 1980-10-02 Molding die

Publications (1)

Publication Number Publication Date
JPS5763212A true JPS5763212A (en) 1982-04-16

Family

ID=15223003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13847880A Pending JPS5763212A (en) 1980-10-02 1980-10-02 Molding die

Country Status (1)

Country Link
JP (1) JPS5763212A (en)

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