JPS5756984A - Assembling method for semiconductor light emitting device - Google Patents
Assembling method for semiconductor light emitting deviceInfo
- Publication number
- JPS5756984A JPS5756984A JP55132486A JP13248680A JPS5756984A JP S5756984 A JPS5756984 A JP S5756984A JP 55132486 A JP55132486 A JP 55132486A JP 13248680 A JP13248680 A JP 13248680A JP S5756984 A JPS5756984 A JP S5756984A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- sink
- chamfering
- soldering
- front surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To readily assemble a semiconductor light emitting element by etching the edge lines of two surfaces crossing with one another at the front surface side of a heat sink soldering the element along the edge line, chamfering it and soldering the element so that the light emitting end face of the element and the front surface of the sink become in the same plane. CONSTITUTION:The edge line of two surfaces crossing with one another at the front surface side of a heat sink carrying a semiconductor laser 2 is etched along the edge line, and a chamfering part 7 is formed. The light emitting end face 4 of a laser 2 is diposed at the chamfering part 7, and the light emitting unit 3 and the sink 2 are secured to one another by soldering while maintaining the light emitting unit 3 and the side face of the sink 1 in the same plane. Since the chamfering part 7 is produced with rounded chamfering unit 7' in this manner, solder 5 is sufficiently flowed to eliminate the cavity or the like, and even if the position of the laser 2 is slightly displaced, the fluctuation, shortcircuit and leakage of the emitted light can be remarkably reduced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55132486A JPS5756984A (en) | 1980-09-23 | 1980-09-23 | Assembling method for semiconductor light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55132486A JPS5756984A (en) | 1980-09-23 | 1980-09-23 | Assembling method for semiconductor light emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5756984A true JPS5756984A (en) | 1982-04-05 |
Family
ID=15082492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55132486A Pending JPS5756984A (en) | 1980-09-23 | 1980-09-23 | Assembling method for semiconductor light emitting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5756984A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4550333A (en) * | 1983-09-13 | 1985-10-29 | Xerox Corporation | Light emitting semiconductor mount |
US4987566A (en) * | 1985-07-29 | 1991-01-22 | Mitsubishi Denki Kabushiki Kaisha | Optical head apparatus |
JPH0468572U (en) * | 1990-10-24 | 1992-06-17 | ||
EP0649202A1 (en) * | 1993-10-15 | 1995-04-19 | Toyota Jidosha Kabushiki Kaisha | Semiconductor laser and method of manufacturing the same |
KR20000040031A (en) * | 1998-12-17 | 2000-07-05 | 구자홍 | Solder evaporation method for a laser diode assembling |
DE112017003127T5 (en) | 2016-06-23 | 2019-03-07 | Smc Corporation | speed control |
DE112017005825T5 (en) | 2016-11-18 | 2019-08-08 | Smc Corporation | Composite valve for direct attachment to the connection of a hydraulic device |
-
1980
- 1980-09-23 JP JP55132486A patent/JPS5756984A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4550333A (en) * | 1983-09-13 | 1985-10-29 | Xerox Corporation | Light emitting semiconductor mount |
US4987566A (en) * | 1985-07-29 | 1991-01-22 | Mitsubishi Denki Kabushiki Kaisha | Optical head apparatus |
JPH0468572U (en) * | 1990-10-24 | 1992-06-17 | ||
EP0649202A1 (en) * | 1993-10-15 | 1995-04-19 | Toyota Jidosha Kabushiki Kaisha | Semiconductor laser and method of manufacturing the same |
US5604761A (en) * | 1993-10-15 | 1997-02-18 | Toyota Jidosha Kabushiki Kaisha | Layered semiconductor laser having solder laminations and method of making same |
KR20000040031A (en) * | 1998-12-17 | 2000-07-05 | 구자홍 | Solder evaporation method for a laser diode assembling |
DE112017003127T5 (en) | 2016-06-23 | 2019-03-07 | Smc Corporation | speed control |
DE112017005825T5 (en) | 2016-11-18 | 2019-08-08 | Smc Corporation | Composite valve for direct attachment to the connection of a hydraulic device |
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