JPS5754068A - Ultra high precision adhering method in single surface lapping and polishing of wafer - Google Patents
Ultra high precision adhering method in single surface lapping and polishing of waferInfo
- Publication number
- JPS5754068A JPS5754068A JP55125018A JP12501880A JPS5754068A JP S5754068 A JPS5754068 A JP S5754068A JP 55125018 A JP55125018 A JP 55125018A JP 12501880 A JP12501880 A JP 12501880A JP S5754068 A JPS5754068 A JP S5754068A
- Authority
- JP
- Japan
- Prior art keywords
- adhesives
- wafer
- thickness
- base plate
- filter member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:To ensure predetermined parallelism of crystal wafers even of a small width and to keep accuracy of such wafers within a predetermined range by adhering a crystal wafer to a base plate using a filter member so as to ensure the thickness of adhesives within 1. CONSTITUTION:A filter member 10 having a thickness of about 1mm. is placed on a base plate 6, and mixture liquid 9 containing adhesives 5 and solvent therefor is sprayed thereover from a nozzle 8 of a sprayer of the like. In this case, the mixture liquid 9 will apply to the base plate 6 with impurities and so on removed therefrom which have been contained in the adhesives 5 or the like. Thus, adhesion of a wafer 4 is carried out after removal of the filter member 10. Consequently, the adhesives 5 will be uniform in the thickness and such thickness of the adhesives will be maintained within 1mu in its absolute value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55125018A JPS5754068A (en) | 1980-09-09 | 1980-09-09 | Ultra high precision adhering method in single surface lapping and polishing of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55125018A JPS5754068A (en) | 1980-09-09 | 1980-09-09 | Ultra high precision adhering method in single surface lapping and polishing of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5754068A true JPS5754068A (en) | 1982-03-31 |
Family
ID=14899815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55125018A Pending JPS5754068A (en) | 1980-09-09 | 1980-09-09 | Ultra high precision adhering method in single surface lapping and polishing of wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5754068A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS608070A (en) * | 1983-06-28 | 1985-01-16 | 株式会社アイジ−技術研究所 | Production unit for composite board |
| JPH04115864A (en) * | 1990-09-07 | 1992-04-16 | Nikko Kyodo Co Ltd | Coating method |
| US5304418A (en) * | 1991-12-30 | 1994-04-19 | Nitto Denko Corporation | Dicing-die bonding film |
| US5891285A (en) * | 1996-05-10 | 1999-04-06 | Tefco International Co., Ltd. | Process for manufacturing electroformed patterns |
| US8263220B2 (en) | 2004-08-06 | 2012-09-11 | Nitto Denko Corporation | Work subject material, surface protection sheet and method of working |
-
1980
- 1980-09-09 JP JP55125018A patent/JPS5754068A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS608070A (en) * | 1983-06-28 | 1985-01-16 | 株式会社アイジ−技術研究所 | Production unit for composite board |
| JPS6319348B2 (en) * | 1983-06-28 | 1988-04-22 | Ig Gijutsu Kenkyusho Kk | |
| JPH04115864A (en) * | 1990-09-07 | 1992-04-16 | Nikko Kyodo Co Ltd | Coating method |
| US5304418A (en) * | 1991-12-30 | 1994-04-19 | Nitto Denko Corporation | Dicing-die bonding film |
| US5476565A (en) * | 1991-12-30 | 1995-12-19 | Nitto Denko Corporation | Dicing-die bonding film |
| US5891285A (en) * | 1996-05-10 | 1999-04-06 | Tefco International Co., Ltd. | Process for manufacturing electroformed patterns |
| US8263220B2 (en) | 2004-08-06 | 2012-09-11 | Nitto Denko Corporation | Work subject material, surface protection sheet and method of working |
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