JPS5744493A - Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressure - Google Patents
Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressureInfo
- Publication number
- JPS5744493A JPS5744493A JP12087180A JP12087180A JPS5744493A JP S5744493 A JPS5744493 A JP S5744493A JP 12087180 A JP12087180 A JP 12087180A JP 12087180 A JP12087180 A JP 12087180A JP S5744493 A JPS5744493 A JP S5744493A
- Authority
- JP
- Japan
- Prior art keywords
- low
- braze material
- vapor pressure
- alloy braze
- type alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Contacts (AREA)
- Ceramic Products (AREA)
Abstract
PURPOSE:To provide a titled alloy braze material of a low cost by the specific composition contg. Ag, Si and at least one kind of Fe, Ni and Co, and consisting of the balance Cu. CONSTITUTION:This Cu-Ag type alloy braze material of a low content of Ag has the following composition by weight %: It has the composition contg. 5-35% Ag, 2.5-13% Si and 1-10% >= at least one kind of Fe, Ni and Co, and if necessary 1-10% >= Sn and/or In, and consisting of the balance Cu and unavoidable impurities. Although this alloy braze material is relatively low in the content of Ag, it has extremely low vapor pressure and m.p. and has good wettability.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12087180A JPS5744493A (en) | 1980-09-01 | 1980-09-01 | Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressure |
DE8181902372T DE3172679D1 (en) | 1980-09-01 | 1981-08-25 | Cu-ag base alloy brazing filler material |
US06/373,498 US4416853A (en) | 1980-09-01 | 1981-08-25 | Cu-Ag base alloy brazing filler material |
EP81902372A EP0058206B1 (en) | 1980-09-01 | 1981-08-25 | Cu-ag base alloy brazing filler material |
PCT/JP1981/000189 WO1982000790A1 (en) | 1980-09-01 | 1981-08-25 | Low-silver cu-ag alloy solder having good soldering properties and low vapor pressure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12087180A JPS5744493A (en) | 1980-09-01 | 1980-09-01 | Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5744493A true JPS5744493A (en) | 1982-03-12 |
JPS6113914B2 JPS6113914B2 (en) | 1986-04-16 |
Family
ID=14797009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12087180A Granted JPS5744493A (en) | 1980-09-01 | 1980-09-01 | Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5744493A (en) |
-
1980
- 1980-09-01 JP JP12087180A patent/JPS5744493A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6113914B2 (en) | 1986-04-16 |
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