JPS5743489A - Method of producing cirucit board - Google Patents

Method of producing cirucit board

Info

Publication number
JPS5743489A
JPS5743489A JP9881181A JP9881181A JPS5743489A JP S5743489 A JPS5743489 A JP S5743489A JP 9881181 A JP9881181 A JP 9881181A JP 9881181 A JP9881181 A JP 9881181A JP S5743489 A JPS5743489 A JP S5743489A
Authority
JP
Japan
Prior art keywords
producing
cirucit board
cirucit
board
producing cirucit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9881181A
Other languages
Japanese (ja)
Other versions
JPS5742992B2 (en
Inventor
Youichi Ootsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP9881181A priority Critical patent/JPS5743489A/en
Publication of JPS5743489A publication Critical patent/JPS5743489A/en
Publication of JPS5742992B2 publication Critical patent/JPS5742992B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP9881181A 1981-06-25 1981-06-25 Method of producing cirucit board Granted JPS5743489A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9881181A JPS5743489A (en) 1981-06-25 1981-06-25 Method of producing cirucit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9881181A JPS5743489A (en) 1981-06-25 1981-06-25 Method of producing cirucit board

Publications (2)

Publication Number Publication Date
JPS5743489A true JPS5743489A (en) 1982-03-11
JPS5742992B2 JPS5742992B2 (en) 1982-09-11

Family

ID=14229708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9881181A Granted JPS5743489A (en) 1981-06-25 1981-06-25 Method of producing cirucit board

Country Status (1)

Country Link
JP (1) JPS5743489A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61217432A (en) * 1985-03-22 1986-09-27 Kawasaki Heavy Ind Ltd Delivery tube of fluid layer device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3332889B1 (en) 2015-09-16 2020-12-09 JFE Steel Corporation Continuous casting method for slab casting piece

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61217432A (en) * 1985-03-22 1986-09-27 Kawasaki Heavy Ind Ltd Delivery tube of fluid layer device

Also Published As

Publication number Publication date
JPS5742992B2 (en) 1982-09-11

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