JPS5742167A - Production of mos type semiconductor device - Google Patents

Production of mos type semiconductor device

Info

Publication number
JPS5742167A
JPS5742167A JP11761780A JP11761780A JPS5742167A JP S5742167 A JPS5742167 A JP S5742167A JP 11761780 A JP11761780 A JP 11761780A JP 11761780 A JP11761780 A JP 11761780A JP S5742167 A JPS5742167 A JP S5742167A
Authority
JP
Japan
Prior art keywords
layer
implanted
film
layers
sio2
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11761780A
Other languages
Japanese (ja)
Inventor
Yoshihisa Mizutani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11761780A priority Critical patent/JPS5742167A/en
Publication of JPS5742167A publication Critical patent/JPS5742167A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE:To obtain an MOS type device higher in the integration level with finer elements and preventing the lowering of a gate breakdown strength and breaking of wires by steps by eliminating overhanging in shape of the gate electrode and irregularities on the surface of the elements due to the electrode. CONSTITUTION:An SiO2 film 2 and a polycrystaline Si layer 3 are laminated on an Si substrate 1 and after they are covered with an SiO2 film 4 to be a gate insulation film, ions are implanted into the layer 3 to be turned to an n<+> type layer. Then, a polycrystaline Si is stacked on the film 4 and turned to a p type layer 5 by a similar ion implantation to control the threshold voltage. A photoresist film 6 as mask is provided on a region intended to form a channel and O2 ion is implanted into the layer 3 not covered with the film 6 to form O2 implanted layers 31. Then, p ions are implanted into the layer 5 to form a p-implanted layer 51. After the layer 6 is removed, the layers 31 are changed to SiO2 layers 32 by heat treatment so that a part 3' of the layer 3 laid between the layers 32 is used for a gate electrode 7. Then, an n<+> type source region 8 and a drain region 9 are formed at both sides of a part 5' of layer 51 by diffusion.
JP11761780A 1980-08-26 1980-08-26 Production of mos type semiconductor device Pending JPS5742167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11761780A JPS5742167A (en) 1980-08-26 1980-08-26 Production of mos type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11761780A JPS5742167A (en) 1980-08-26 1980-08-26 Production of mos type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5742167A true JPS5742167A (en) 1982-03-09

Family

ID=14716182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11761780A Pending JPS5742167A (en) 1980-08-26 1980-08-26 Production of mos type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5742167A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201364A (en) * 1982-05-20 1983-11-24 Matsushita Electric Ind Co Ltd Semiconductor device and manufacture thereof
JPH0529347A (en) * 1990-10-12 1993-02-05 Mitsubishi Electric Corp Semiconductor device and manufacturing method therefor
JPH05211166A (en) * 1991-12-02 1993-08-20 Nec Corp Thin film field-effect trasistor
US5904911A (en) * 1997-02-28 1999-05-18 Nec Corporation Manganese-containing complex oxide, and process for preparing complex perovskite compound composition by use of this complex oxide

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201364A (en) * 1982-05-20 1983-11-24 Matsushita Electric Ind Co Ltd Semiconductor device and manufacture thereof
JPH0529347A (en) * 1990-10-12 1993-02-05 Mitsubishi Electric Corp Semiconductor device and manufacturing method therefor
JPH05211166A (en) * 1991-12-02 1993-08-20 Nec Corp Thin film field-effect trasistor
US5904911A (en) * 1997-02-28 1999-05-18 Nec Corporation Manganese-containing complex oxide, and process for preparing complex perovskite compound composition by use of this complex oxide

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