JPS5741368A - Vacuum treatment chamber containing trap member - Google Patents

Vacuum treatment chamber containing trap member

Info

Publication number
JPS5741368A
JPS5741368A JP11647780A JP11647780A JPS5741368A JP S5741368 A JPS5741368 A JP S5741368A JP 11647780 A JP11647780 A JP 11647780A JP 11647780 A JP11647780 A JP 11647780A JP S5741368 A JPS5741368 A JP S5741368A
Authority
JP
Japan
Prior art keywords
impurities
trap member
capturing
vacuum
backflowing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11647780A
Other languages
Japanese (ja)
Inventor
Katsuya Okumura
Toshiaki Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Ulvac Inc
Original Assignee
Toshiba Corp
Ulvac Inc
Nihon Shinku Gijutsu KK
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Ulvac Inc, Nihon Shinku Gijutsu KK, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11647780A priority Critical patent/JPS5741368A/en
Publication of JPS5741368A publication Critical patent/JPS5741368A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Furnace Details (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:To prevent effluent and backflowing impurities from intruding into articles by suitably disposing a trap member which is provided with a capturing surface cooled by a sub-zero refrigerant and has venting parts in a vacuum chamber. CONSTITUTION:After the inside of a vacuum vessle 11 is roughly evacuated with a rough evacuating system 12, the system 12 is shut off, and a high vacuum is developed by a cryogenic pump 13. For example, gaseous Ar is introduced from a gaseous source 15 and an article 16 to be treated is subjected to sputtering treatment. At this time, a sub-zero refrigerant is flowed in a trap member 20 so that the surface of a tube 21 forming the coil serves as a capturing surface for condensing and capturing impurities. The clearances between the turns and upper and lower opening parts of the coil form venting parts that permit passage of the gas. Then, effluent impurities, backflowing impurities and other impurities are condensed and captured without hampering the maintenance of a required low pressure atmosphere, and the intrusion of these impurities into the article 16 to be treated is prevented.
JP11647780A 1980-08-26 1980-08-26 Vacuum treatment chamber containing trap member Pending JPS5741368A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11647780A JPS5741368A (en) 1980-08-26 1980-08-26 Vacuum treatment chamber containing trap member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11647780A JPS5741368A (en) 1980-08-26 1980-08-26 Vacuum treatment chamber containing trap member

Publications (1)

Publication Number Publication Date
JPS5741368A true JPS5741368A (en) 1982-03-08

Family

ID=14688067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11647780A Pending JPS5741368A (en) 1980-08-26 1980-08-26 Vacuum treatment chamber containing trap member

Country Status (1)

Country Link
JP (1) JPS5741368A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133633A (en) * 1981-02-13 1982-08-18 Anelva Corp Dry-etching device
JPS5912865U (en) * 1982-07-17 1984-01-26 日本真空技術株式会社 Vacuum film forming equipment
JPS5980461U (en) * 1982-11-18 1984-05-31 三洋電機株式会社 vacuum equipment
JPH02138424U (en) * 1990-03-02 1990-11-19

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133633A (en) * 1981-02-13 1982-08-18 Anelva Corp Dry-etching device
JPS5912865U (en) * 1982-07-17 1984-01-26 日本真空技術株式会社 Vacuum film forming equipment
JPS5980461U (en) * 1982-11-18 1984-05-31 三洋電機株式会社 vacuum equipment
JPH02138424U (en) * 1990-03-02 1990-11-19

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