JPS5740964A - Cooling device for semiconductor power element - Google Patents

Cooling device for semiconductor power element

Info

Publication number
JPS5740964A
JPS5740964A JP11647180A JP11647180A JPS5740964A JP S5740964 A JPS5740964 A JP S5740964A JP 11647180 A JP11647180 A JP 11647180A JP 11647180 A JP11647180 A JP 11647180A JP S5740964 A JPS5740964 A JP S5740964A
Authority
JP
Japan
Prior art keywords
cooling
common conductor
heat
conductor
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11647180A
Other languages
Japanese (ja)
Inventor
Minoru Ebara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11647180A priority Critical patent/JPS5740964A/en
Publication of JPS5740964A publication Critical patent/JPS5740964A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To improve the cooling effect of semiconductor elements and realize structural compactness, by combining a conductor which supports flat semiconductors with a heat pipe and a cooling fin. CONSTITUTION:Heat loss produced at each semiconductor element is transmitted to either common conductor of P1, P2 or N, and also to a cooling fin via a heat pipe 15 inserted between these common conductors. As heat conductivity of the heat pipe 15 is very high, temperature difference between the common conductor and the cooling fin is very small. Cooling air is sucked through a rear panel suction, part by means of a cooling fan, heat-exchanged through cooling fins, and exhausted swiftly upwards. In the Fig, a positive-side common conductor for a forward converter is represented as P1, a positive-side common conductor for an reverse converter as P2, a negative-side common conductor for both forward and reverse converters as N, inputs as U, V and W, and outputs as R, S and T.
JP11647180A 1980-08-26 1980-08-26 Cooling device for semiconductor power element Pending JPS5740964A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11647180A JPS5740964A (en) 1980-08-26 1980-08-26 Cooling device for semiconductor power element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11647180A JPS5740964A (en) 1980-08-26 1980-08-26 Cooling device for semiconductor power element

Publications (1)

Publication Number Publication Date
JPS5740964A true JPS5740964A (en) 1982-03-06

Family

ID=14687919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11647180A Pending JPS5740964A (en) 1980-08-26 1980-08-26 Cooling device for semiconductor power element

Country Status (1)

Country Link
JP (1) JPS5740964A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4896678A (en) * 1986-12-12 1990-01-30 Olympus Optical Co., Ltd. Endoscopic treating tool
US7992318B2 (en) * 2007-01-22 2011-08-09 Tokyo Electron Limited Heating apparatus, heating method, and computer readable storage medium

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4896678A (en) * 1986-12-12 1990-01-30 Olympus Optical Co., Ltd. Endoscopic treating tool
US7992318B2 (en) * 2007-01-22 2011-08-09 Tokyo Electron Limited Heating apparatus, heating method, and computer readable storage medium
US8186077B2 (en) 2007-01-22 2012-05-29 Tokyo Electron Limited Heating apparatus, heating method, and computer readable storage medium

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