JPS5730319A - Automatic manufacturing equipment of integrated circuit device - Google Patents

Automatic manufacturing equipment of integrated circuit device

Info

Publication number
JPS5730319A
JPS5730319A JP10541080A JP10541080A JPS5730319A JP S5730319 A JPS5730319 A JP S5730319A JP 10541080 A JP10541080 A JP 10541080A JP 10541080 A JP10541080 A JP 10541080A JP S5730319 A JPS5730319 A JP S5730319A
Authority
JP
Japan
Prior art keywords
pedestal part
treating
wafer
transported
treating devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10541080A
Other languages
Japanese (ja)
Other versions
JPS645452B2 (en
Inventor
Junji Sakurai
Nobuo Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10541080A priority Critical patent/JPS5730319A/en
Publication of JPS5730319A publication Critical patent/JPS5730319A/en
Publication of JPS645452B2 publication Critical patent/JPS645452B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To rationalize manufacture of an IC by a method wherein a pedestal part to put a wafer thereon is arranged at the center, various kinds of treating devices are arranged radially, and the wafer is transported to the treating devices constantly via the pedestal part by a transporting means to receive treatment and is made to come back to the pedestal part. CONSTITUTION:The wafer being put on the center pedestal part 30 is transported through an air track 50 via an auxiliary pedestal 52 to one of the treating devices 32 extending radially to receive treatment, comes back again to the pedestal part 30 through the air track and is transported to the treating device 34 to receive another treatment, and comes back to the pedestal part 30. After then receives samely treatments of the treating devices 36...48, and is finally taken out from the pedestal part 30. At this time, command of transportation or wait, etc., of the wafer is performed by a computor, and the radial treating group may be arranged in plural number. Accordingly flow of manufacture of the IC is rationalized, the number of the treating devices is reduced, and change of treating process is facilitated.
JP10541080A 1980-07-31 1980-07-31 Automatic manufacturing equipment of integrated circuit device Granted JPS5730319A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10541080A JPS5730319A (en) 1980-07-31 1980-07-31 Automatic manufacturing equipment of integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10541080A JPS5730319A (en) 1980-07-31 1980-07-31 Automatic manufacturing equipment of integrated circuit device

Publications (2)

Publication Number Publication Date
JPS5730319A true JPS5730319A (en) 1982-02-18
JPS645452B2 JPS645452B2 (en) 1989-01-30

Family

ID=14406833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10541080A Granted JPS5730319A (en) 1980-07-31 1980-07-31 Automatic manufacturing equipment of integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5730319A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176547U (en) * 1984-04-27 1985-11-22 富士通株式会社 Wafer processing equipment
JPS60245236A (en) * 1984-05-21 1985-12-05 Hitachi Ltd Semiconductor manufacturing apparatus
JPS6413794A (en) * 1987-07-08 1989-01-18 Hitachi Ltd Forming method for circuit
JPH01253249A (en) * 1988-03-31 1989-10-09 Tokyo Electron Ltd Semiconductor manufacturing device
US5639847A (en) * 1995-05-25 1997-06-17 Mearthane Products Corp. Preparation of conductive polyurethanes using a conductive quasi-solution
US6111051A (en) * 1998-08-07 2000-08-29 Mearthane Products Corporation Preparation of conductive polyurethanes using a conductive quasi-solution
US6361484B1 (en) 1992-04-16 2002-03-26 Mearthane Products Corporation Electrically conductive and semi-conductive polymers
US6451438B1 (en) 2000-11-30 2002-09-17 Mearthane Products Corporation Copolymerization of reactive silicone and urethane precursors for use in conductive, soft urethane rollers

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0594958U (en) * 1992-05-28 1993-12-24 三洋電機株式会社 Circuit board device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176547U (en) * 1984-04-27 1985-11-22 富士通株式会社 Wafer processing equipment
JPS60245236A (en) * 1984-05-21 1985-12-05 Hitachi Ltd Semiconductor manufacturing apparatus
JPS6413794A (en) * 1987-07-08 1989-01-18 Hitachi Ltd Forming method for circuit
JPH01253249A (en) * 1988-03-31 1989-10-09 Tokyo Electron Ltd Semiconductor manufacturing device
US6361484B1 (en) 1992-04-16 2002-03-26 Mearthane Products Corporation Electrically conductive and semi-conductive polymers
US5639847A (en) * 1995-05-25 1997-06-17 Mearthane Products Corp. Preparation of conductive polyurethanes using a conductive quasi-solution
US5898057A (en) * 1995-05-25 1999-04-27 Mearthane Products Corp. Preparation of conductive polyurethanes using a conductive quasi-solution
US6184331B1 (en) 1995-05-25 2001-02-06 Mearthane Products Corporation Preparation of conductive polyurethanes using a conductive quasi-solution
US6417315B2 (en) 1995-05-25 2002-07-09 Mearthane Products Corporation Preparation of conductive polyurethanes using a conductive quasi-solution
US6111051A (en) * 1998-08-07 2000-08-29 Mearthane Products Corporation Preparation of conductive polyurethanes using a conductive quasi-solution
US6451438B1 (en) 2000-11-30 2002-09-17 Mearthane Products Corporation Copolymerization of reactive silicone and urethane precursors for use in conductive, soft urethane rollers

Also Published As

Publication number Publication date
JPS645452B2 (en) 1989-01-30

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