JPS572850A - Copper alloy for lead material of semiconductor device - Google Patents
Copper alloy for lead material of semiconductor deviceInfo
- Publication number
- JPS572850A JPS572850A JP7557480A JP7557480A JPS572850A JP S572850 A JPS572850 A JP S572850A JP 7557480 A JP7557480 A JP 7557480A JP 7557480 A JP7557480 A JP 7557480A JP S572850 A JPS572850 A JP S572850A
- Authority
- JP
- Japan
- Prior art keywords
- lead material
- semiconductor device
- alloy
- copper alloy
- balance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To provide a Cu alloy contg. a prescribed percentage each of Ni and P besides the balance Cu and suitable for use as a lead material of a semiconductor device such as transistor or IC.
CONSTITUTION: This invention relates to a Cu alloy for a lead material of a semiconductor device consisting of 0.01W1.0wt% Ni, 0.002W0.1wt% P and the balance Cu with inevitable impurities. The defects of conventional oxygen-free copper, phosphor bronze, Sn-contg. copper or other Cu alloy are improved, and this Cu alloy has various characteristics suitable for use as a lead material of a semiconductor device. That is, this alloy is excellent in all of heat releasing properties, heat resistance, strength, solderability, plating adhesion, etc. necessary for a lead material.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7557480A JPS5818981B2 (en) | 1980-06-06 | 1980-06-06 | Copper alloy for lead material of semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7557480A JPS5818981B2 (en) | 1980-06-06 | 1980-06-06 | Copper alloy for lead material of semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS572850A true JPS572850A (en) | 1982-01-08 |
| JPS5818981B2 JPS5818981B2 (en) | 1983-04-15 |
Family
ID=13580090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7557480A Expired JPS5818981B2 (en) | 1980-06-06 | 1980-06-06 | Copper alloy for lead material of semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5818981B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58104148A (en) * | 1981-12-14 | 1983-06-21 | Furukawa Electric Co Ltd:The | Copper alloy for lead material of semiconductor apparatus |
| US4466939A (en) * | 1982-10-20 | 1984-08-21 | Poong San Metal Corporation | Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts |
| JPS6324028A (en) * | 1986-06-20 | 1988-02-01 | カ−ベル−ウント・メタルウエルケ・グ−テホフヌングスヒユツテ・アクチエンゲゼルシヤフト | Copper alloy and its use as working material for continuous casting mold |
-
1980
- 1980-06-06 JP JP7557480A patent/JPS5818981B2/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58104148A (en) * | 1981-12-14 | 1983-06-21 | Furukawa Electric Co Ltd:The | Copper alloy for lead material of semiconductor apparatus |
| US4466939A (en) * | 1982-10-20 | 1984-08-21 | Poong San Metal Corporation | Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts |
| JPS6324028A (en) * | 1986-06-20 | 1988-02-01 | カ−ベル−ウント・メタルウエルケ・グ−テホフヌングスヒユツテ・アクチエンゲゼルシヤフト | Copper alloy and its use as working material for continuous casting mold |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5818981B2 (en) | 1983-04-15 |
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