JPS5727741A - Manufacture of particle board - Google Patents

Manufacture of particle board

Info

Publication number
JPS5727741A
JPS5727741A JP10270180A JP10270180A JPS5727741A JP S5727741 A JPS5727741 A JP S5727741A JP 10270180 A JP10270180 A JP 10270180A JP 10270180 A JP10270180 A JP 10270180A JP S5727741 A JPS5727741 A JP S5727741A
Authority
JP
Japan
Prior art keywords
chips
coated
adhesives
particle board
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10270180A
Other languages
Japanese (ja)
Inventor
Tsuyoshi Fukui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meinan Machinery Works Inc
Original Assignee
Meinan Machinery Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meinan Machinery Works Inc filed Critical Meinan Machinery Works Inc
Priority to JP10270180A priority Critical patent/JPS5727741A/en
Publication of JPS5727741A publication Critical patent/JPS5727741A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

PURPOSE: To obtain a homogeneous particle board poor in thickness deviation by a method wherein resin is coated on the surface of chips, hardened suitably, then coated with adhesives and molded into a suitable shape and the molded products are cut in a sheet form.
CONSTITUTION: Resin 3 like urea, vinyl acetate, etc. is coated by a spray 2 or the like on the surface of chips 1 and hardened suitably by hot blast 3 or the like. Then, adhesives 5 are coated by a spray 2 or the like on the chips 1 having suitably hardened resin film on the surface and then the chips are molded by a cylinder press 6 or the like under pressure or by heating into molded products 7 in a suitable form like a column, a cylinder, etc. The molded products 7 are lathed or planed by a cutter 8 in a sheet form to obtain a particle board having a desired thickness. Adhesives are prevented by the resin film previously provided from permeating into the chips to make possible reliable welding between the chips.
COPYRIGHT: (C)1982,JPO&Japio
JP10270180A 1980-07-25 1980-07-25 Manufacture of particle board Pending JPS5727741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10270180A JPS5727741A (en) 1980-07-25 1980-07-25 Manufacture of particle board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10270180A JPS5727741A (en) 1980-07-25 1980-07-25 Manufacture of particle board

Publications (1)

Publication Number Publication Date
JPS5727741A true JPS5727741A (en) 1982-02-15

Family

ID=14334557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10270180A Pending JPS5727741A (en) 1980-07-25 1980-07-25 Manufacture of particle board

Country Status (1)

Country Link
JP (1) JPS5727741A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01207137A (en) * 1987-10-23 1989-08-21 Phillips Petroleum Co Carrier for catalyst and manufacture of catalyst and dimerization method of olefin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01207137A (en) * 1987-10-23 1989-08-21 Phillips Petroleum Co Carrier for catalyst and manufacture of catalyst and dimerization method of olefin

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