JPS5725636B2 - - Google Patents

Info

Publication number
JPS5725636B2
JPS5725636B2 JP2846874A JP2846874A JPS5725636B2 JP S5725636 B2 JPS5725636 B2 JP S5725636B2 JP 2846874 A JP2846874 A JP 2846874A JP 2846874 A JP2846874 A JP 2846874A JP S5725636 B2 JPS5725636 B2 JP S5725636B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2846874A
Other versions
JPS49122434A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS49122434A publication Critical patent/JPS49122434A/ja
Publication of JPS5725636B2 publication Critical patent/JPS5725636B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals
JP2846874A 1973-03-13 1974-03-12 Expired JPS5725636B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US340912A US3888778A (en) 1973-03-13 1973-03-13 Bright dip composition for tin/lead

Publications (2)

Publication Number Publication Date
JPS49122434A JPS49122434A (ja) 1974-11-22
JPS5725636B2 true JPS5725636B2 (ja) 1982-05-31

Family

ID=23335448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2846874A Expired JPS5725636B2 (ja) 1973-03-13 1974-03-12

Country Status (5)

Country Link
US (1) US3888778A (ja)
JP (1) JPS5725636B2 (ja)
CA (1) CA1020067A (ja)
DE (1) DE2412134C3 (ja)
GB (1) GB1453886A (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4004956A (en) * 1974-08-14 1977-01-25 Enthone, Incorporated Selectively stripping tin or tin-lead alloys from copper substrates
US4297257A (en) * 1980-04-17 1981-10-27 Dart Industries Inc. Metal stripping composition and method
IT1144797B (it) * 1981-10-14 1986-10-29 Alfachimici Spa Soluzione per l asportazione di stagno o lega stagno piombo da un substrato mediante operazione a spruzzo
USRE32555E (en) * 1982-09-20 1987-12-08 Circuit Chemistry Corporation Solder stripping solution
US4713144A (en) * 1986-08-01 1987-12-15 Ardrox Inc. Composition and method for stripping films from printed circuit boards
DE19510825A1 (de) * 1995-03-24 1996-09-26 Henkel Kgaa Korrosionsschützender Reiniger für verzinnten Stahl
US6461534B2 (en) * 1997-11-19 2002-10-08 Europa Metalli S. P. A. Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same
JP6078525B2 (ja) * 2014-12-25 2017-02-08 メック株式会社 無電解スズメッキ被膜表面の洗浄液およびその補給液、ならびにスズメッキ層の形成方法
JP6429079B2 (ja) * 2015-02-12 2018-11-28 メック株式会社 エッチング液及びエッチング方法
TW201930647A (zh) * 2017-12-22 2019-08-01 德商德國艾托特克公司 用於選擇性移除鈀之方法及處理組合物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3181984A (en) * 1962-05-04 1965-05-04 Fmc Corp Cleaning and brightening of solder
US3677949A (en) * 1970-09-04 1972-07-18 Enthone Selectively stripping tin and/or lead from copper substrates

Also Published As

Publication number Publication date
CA1020067A (en) 1977-11-01
JPS49122434A (ja) 1974-11-22
DE2412134B2 (de) 1978-04-06
DE2412134C3 (de) 1978-11-30
DE2412134A1 (de) 1974-10-03
US3888778A (en) 1975-06-10
GB1453886A (en) 1976-10-27

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