JPS5724927B2 - - Google Patents

Info

Publication number
JPS5724927B2
JPS5724927B2 JP1465577A JP1465577A JPS5724927B2 JP S5724927 B2 JPS5724927 B2 JP S5724927B2 JP 1465577 A JP1465577 A JP 1465577A JP 1465577 A JP1465577 A JP 1465577A JP S5724927 B2 JPS5724927 B2 JP S5724927B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1465577A
Other languages
Japanese (ja)
Other versions
JPS53100765A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1465577A priority Critical patent/JPS53100765A/en
Publication of JPS53100765A publication Critical patent/JPS53100765A/en
Publication of JPS5724927B2 publication Critical patent/JPS5724927B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting

Landscapes

  • Die Bonding (AREA)
  • Dicing (AREA)
JP1465577A 1977-02-15 1977-02-15 Production of semiconductor device Granted JPS53100765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1465577A JPS53100765A (en) 1977-02-15 1977-02-15 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1465577A JPS53100765A (en) 1977-02-15 1977-02-15 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS53100765A JPS53100765A (en) 1978-09-02
JPS5724927B2 true JPS5724927B2 (en) 1982-05-26

Family

ID=11867220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1465577A Granted JPS53100765A (en) 1977-02-15 1977-02-15 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53100765A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543853A (en) * 1978-09-25 1980-03-27 Hitachi Ltd Dicing
JPS5632904U (en) * 1979-08-22 1981-03-31
JPS5989538U (en) * 1982-12-08 1984-06-18 日本電気ホームエレクトロニクス株式会社 pellet pick up device
JP2737859B2 (en) * 1991-06-14 1998-04-08 シャープ株式会社 Manufacturing method of semiconductor chip
KR100425946B1 (en) * 2002-02-20 2004-04-01 주식회사 칩팩코리아 METHOD FOR FORMING Au STUD BUMP OF FLIP CHIP PACKAGE
DE102011017218B4 (en) 2011-04-15 2018-10-31 Mühlbauer Gmbh & Co. Kg Apparatus and method for transferring electronic components from a first carrier to a second carrier
DE102011104225B4 (en) * 2011-06-15 2017-08-24 Mühlbauer Gmbh & Co. Kg Apparatus and method for positioning an electronic component and / or a carrier relative to an ejector
DE102018006771B4 (en) 2018-08-27 2022-09-08 Mühlbauer Gmbh & Co. Kg Device and method for transferring electronic components from a first to a second carrier
DE102018006760A1 (en) 2018-08-27 2020-02-27 Mühlbauer Gmbh & Co. Kg Inspection when transferring electronic components from a first to a second carrier
DE102020001439B3 (en) * 2020-02-21 2021-06-10 Mühlbauer Gmbh & Co. Kg Apparatus and method for transferring electronic components from a first to a second carrier
DE102020005484A1 (en) 2020-09-07 2022-03-10 Mühlbauer Gmbh & Co. Kg Devices and methods for operating at least two tools

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040943A (en) * 1972-08-30 1975-04-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040943A (en) * 1972-08-30 1975-04-15

Also Published As

Publication number Publication date
JPS53100765A (en) 1978-09-02

Similar Documents

Publication Publication Date Title
DE2746938C2 (en)
DE2816039C2 (en)
DE2710705C3 (en)
FR2377080B1 (en)
JPS5724927B2 (en)
AU3353778A (en)
JPS5751937B2 (en)
AU495917B2 (en)
FR2377143B1 (en)
DE2751507B2 (en)
AU71461S (en)
BG25853A1 (en)
BE873002A (en)
BG25840A1 (en)
BE870787A (en)
BE868323A (en)
BE866391A (en)
BE865722A (en)
BE851449A (en)
BG25890A1 (en)
BG25860A1 (en)
BG25855A1 (en)
BG25837A1 (en)
BG25838A1 (en)
BE871419A (en)