JPS5721848A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5721848A JPS5721848A JP9720480A JP9720480A JPS5721848A JP S5721848 A JPS5721848 A JP S5721848A JP 9720480 A JP9720480 A JP 9720480A JP 9720480 A JP9720480 A JP 9720480A JP S5721848 A JPS5721848 A JP S5721848A
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- bent
- board
- semiconductor device
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To obtain a semiconductor device capable of being readily and effectively mounted on a printed circuit board by using both a terminal for perpendicularly picking up and a terminal bent in an L-shaped on the side face of a package. CONSTITUTION:Terminals 12a picked up rectilinearly in a perpendicular direction with respect to the side face of a package 11 and bent terminals 12b of the shape bent in an L shape are alternately arranged. When multiterminal elements 11 are mounted on a printed circuit board, the bent terminals 12b are inserted into the holes 13s of the board, are soldered to the pattern on the back surface, and the terminals 12a are soldered to the pattern on the surface of the board. Thus, it can facilitate positioning and inserting of the terminals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9720480A JPS5721848A (en) | 1980-07-16 | 1980-07-16 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9720480A JPS5721848A (en) | 1980-07-16 | 1980-07-16 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5721848A true JPS5721848A (en) | 1982-02-04 |
Family
ID=14186077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9720480A Pending JPS5721848A (en) | 1980-07-16 | 1980-07-16 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5721848A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58165394A (en) * | 1982-03-26 | 1983-09-30 | キヤノン株式会社 | Mounting structure for electronic part |
JPS59191743U (en) * | 1983-06-06 | 1984-12-19 | シャープ株式会社 | IC package |
JPS61140526U (en) * | 1985-02-20 | 1986-08-30 | ||
JPH04105526U (en) * | 1991-02-22 | 1992-09-10 | 日本電気株式会社 | Cylindrical chip parts |
-
1980
- 1980-07-16 JP JP9720480A patent/JPS5721848A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58165394A (en) * | 1982-03-26 | 1983-09-30 | キヤノン株式会社 | Mounting structure for electronic part |
JPS59191743U (en) * | 1983-06-06 | 1984-12-19 | シャープ株式会社 | IC package |
JPS61140526U (en) * | 1985-02-20 | 1986-08-30 | ||
JPH04105526U (en) * | 1991-02-22 | 1992-09-10 | 日本電気株式会社 | Cylindrical chip parts |
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