JPS5721270A - Grinder stone having diamond or cbn as granules - Google Patents

Grinder stone having diamond or cbn as granules

Info

Publication number
JPS5721270A
JPS5721270A JP9349580A JP9349580A JPS5721270A JP S5721270 A JPS5721270 A JP S5721270A JP 9349580 A JP9349580 A JP 9349580A JP 9349580 A JP9349580 A JP 9349580A JP S5721270 A JPS5721270 A JP S5721270A
Authority
JP
Japan
Prior art keywords
grinder stone
mixed
bond
stone
grinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9349580A
Other languages
Japanese (ja)
Inventor
Masaji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Diamond Industrial Co Ltd
Original Assignee
Asahi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Diamond Industrial Co Ltd filed Critical Asahi Diamond Industrial Co Ltd
Priority to JP9349580A priority Critical patent/JPS5721270A/en
Publication of JPS5721270A publication Critical patent/JPS5721270A/en
Pending legal-status Critical Current

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  • Polishing Bodies And Polishing Tools (AREA)

Abstract

PURPOSE: To prevent a clogging in the grinder stone by a method wherein some hollow sphere balls of glass or graphite are mixed in a bond to prevent a clogging in the grinder stone as well as to improve a cutting characteristic and some chip pockets are formed in a surface of the grinder stone.
CONSTITUTION: Hollow glass sphere balls 1 having a particle mesh size of 52 commercially available are selected by a sieve so as to select the particles of 60/80 meshes, nickel is plated by nonelectrolyte process to form a specific weight of 2.5. This is mixed in a standard metal bond 2. Mixing ratio is 2.5% by a volumetric ratio at its most suitable value. Metal bonding synthetic diamond 3 is mixed to the mixing bond at a rate of 3ct/cc so as to form a circular grinder stone. Grinding resistance is decreased, a grinding ratio is improved, a file and a cutting characteristic of the grinder stone may be improved.
COPYRIGHT: (C)1982,JPO&Japio
JP9349580A 1980-07-09 1980-07-09 Grinder stone having diamond or cbn as granules Pending JPS5721270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9349580A JPS5721270A (en) 1980-07-09 1980-07-09 Grinder stone having diamond or cbn as granules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9349580A JPS5721270A (en) 1980-07-09 1980-07-09 Grinder stone having diamond or cbn as granules

Publications (1)

Publication Number Publication Date
JPS5721270A true JPS5721270A (en) 1982-02-03

Family

ID=14083920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9349580A Pending JPS5721270A (en) 1980-07-09 1980-07-09 Grinder stone having diamond or cbn as granules

Country Status (1)

Country Link
JP (1) JPS5721270A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62251077A (en) * 1986-04-21 1987-10-31 Noritake Co Ltd Vitrifide grinding element
JPS637459U (en) * 1986-06-30 1988-01-19
JPH01316174A (en) * 1988-06-16 1989-12-21 Noritake Co Ltd Vitrified super grain grindstone
JPH05277953A (en) * 1992-03-30 1993-10-26 Mitsubishi Materials Corp Resin bond grinding wheel
JPH08309665A (en) * 1995-05-15 1996-11-26 Osaka Diamond Ind Co Ltd Super abrasive grain grinding wheel and manufacture thereof
JP2013154424A (en) * 2012-01-27 2013-08-15 Tokyo Seimitsu Co Ltd Cutting blade and method for manufacturing the same
JP2013154425A (en) * 2012-01-27 2013-08-15 Tokyo Seimitsu Co Ltd Cutting blade
WO2020262211A1 (en) * 2019-06-27 2020-12-30 株式会社東京ダイヤモンド工具製作所 Synthetic grinding stone

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62251077A (en) * 1986-04-21 1987-10-31 Noritake Co Ltd Vitrifide grinding element
JPS637459U (en) * 1986-06-30 1988-01-19
JPH01316174A (en) * 1988-06-16 1989-12-21 Noritake Co Ltd Vitrified super grain grindstone
JPH05277953A (en) * 1992-03-30 1993-10-26 Mitsubishi Materials Corp Resin bond grinding wheel
JPH08309665A (en) * 1995-05-15 1996-11-26 Osaka Diamond Ind Co Ltd Super abrasive grain grinding wheel and manufacture thereof
JP2013154424A (en) * 2012-01-27 2013-08-15 Tokyo Seimitsu Co Ltd Cutting blade and method for manufacturing the same
JP2013154425A (en) * 2012-01-27 2013-08-15 Tokyo Seimitsu Co Ltd Cutting blade
WO2020262211A1 (en) * 2019-06-27 2020-12-30 株式会社東京ダイヤモンド工具製作所 Synthetic grinding stone
JP2021003795A (en) * 2019-06-27 2021-01-14 株式会社東京ダイヤモンド工具製作所 Synthetic grind stone

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