JPS57207556A - Electric dust collector - Google Patents
Electric dust collectorInfo
- Publication number
- JPS57207556A JPS57207556A JP56090652A JP9065281A JPS57207556A JP S57207556 A JPS57207556 A JP S57207556A JP 56090652 A JP56090652 A JP 56090652A JP 9065281 A JP9065281 A JP 9065281A JP S57207556 A JPS57207556 A JP S57207556A
- Authority
- JP
- Japan
- Prior art keywords
- sides
- parts
- electrode
- insulating
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000428 dust Substances 0.000 title abstract 3
- 238000005452 bending Methods 0.000 abstract 1
- 239000003973 paint Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/518—Insulating materials associated therewith the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4916—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
- H01L29/4925—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement
- H01L29/4933—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement with a silicide layer contacting the silicon layer, e.g. Polycide gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28211—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation in a gaseous ambient using an oxygen or a water vapour, e.g. RTO, possibly through a layer
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electrostatic Separation (AREA)
- Semiconductor Memories (AREA)
Abstract
PURPOSE: To improve efficiency of assembling work of dust collecting section and prevent erroneous assembling by exposing conductive layers alternately on both sides in the center of an insulating film, and forming electrode plates provided with uneven parts that form insulating parts on both sides.
CONSTITUTION: Conductive paint is coated at a proper width alternately on the surface and the back of an insulating film 7 along its center. An electrode plate 6 is made by making uneven parts along both sides edges to form insulating parts. This electrode plate 6 is made to a laminated state bending it to different direction at a specified distance, and housed in an outer frame 11 consisting of insulating plates. Conductive parts 9 projected to both sides at the time of folding are connected to electrode plates 12, 13 in common and positive electrode and negative electrode of a DC high voltage power source 14 are connected with electrode plates 12, 13 respectively to constitute a dust collecting section 15.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56090652A JPS57207556A (en) | 1981-06-12 | 1981-06-12 | Electric dust collector |
FR8209135A FR2506989B1 (en) | 1981-06-12 | 1982-05-26 | SEMICONDUCTOR MEMORY DEVICE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56090652A JPS57207556A (en) | 1981-06-12 | 1981-06-12 | Electric dust collector |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57207556A true JPS57207556A (en) | 1982-12-20 |
JPS6344018B2 JPS6344018B2 (en) | 1988-09-02 |
Family
ID=14004443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56090652A Granted JPS57207556A (en) | 1981-06-12 | 1981-06-12 | Electric dust collector |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS57207556A (en) |
FR (1) | FR2506989B1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01174056U (en) * | 1988-05-30 | 1989-12-11 | ||
JPH01174057U (en) * | 1988-05-30 | 1989-12-11 | ||
CN107185713A (en) * | 2017-06-15 | 2017-09-22 | 韦彩丽 | A kind of household electrostatic dedusting adornment |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2555364B1 (en) * | 1983-11-18 | 1990-02-02 | Hitachi Ltd | METHOD FOR MANUFACTURING CONNECTIONS OF A DEVICE WITH INTEGRATED SEMICONDUCTOR CIRCUITS INCLUDING IN PARTICULAR A MITSET |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2815605C3 (en) * | 1978-04-11 | 1981-04-16 | Siemens AG, 1000 Berlin und 8000 München | Semiconductor memory with control lines of high conductivity |
-
1981
- 1981-06-12 JP JP56090652A patent/JPS57207556A/en active Granted
-
1982
- 1982-05-26 FR FR8209135A patent/FR2506989B1/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01174056U (en) * | 1988-05-30 | 1989-12-11 | ||
JPH01174057U (en) * | 1988-05-30 | 1989-12-11 | ||
CN107185713A (en) * | 2017-06-15 | 2017-09-22 | 韦彩丽 | A kind of household electrostatic dedusting adornment |
Also Published As
Publication number | Publication date |
---|---|
JPS6344018B2 (en) | 1988-09-02 |
FR2506989B1 (en) | 1985-06-21 |
FR2506989A1 (en) | 1982-12-03 |
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