JPS57206024A - Method of forming electrode onto compound semiconductor - Google Patents
Method of forming electrode onto compound semiconductorInfo
- Publication number
- JPS57206024A JPS57206024A JP9091081A JP9091081A JPS57206024A JP S57206024 A JPS57206024 A JP S57206024A JP 9091081 A JP9091081 A JP 9091081A JP 9091081 A JP9091081 A JP 9091081A JP S57206024 A JPS57206024 A JP S57206024A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- crystal
- thickness
- evaporated
- constituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract 2
- 150000001875 compounds Chemical class 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000013078 crystal Substances 0.000 abstract 4
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To improve contact resistance and bonding property and constitute an electrode economically at mass production, by a method wherein thickness of Ag layer and amount of Zn within a film are controlled. CONSTITUTION:An n type GaP layer 12 is formed on n type GaP substrate 11 thereby a crystal is constituted, and p type layer 13 is formed on the crystal thereby p-n junction 14 is constituted. The crystal is heated in vacuum of about 10<-6>-10<-7>Torr to about 100-150 deg.C, and Ag is evaporated to thickness of about 300-1,000Angstrom thereby a first Ag layer 23a is formed. Zn is evaporated on the Ag layer 23a to thickness of about 300-1,500Angstrom thereby a second Zn layer 23b is formed. Ag is evaporated on the Zn layer 23b to thickness of about 2,000- 10,000Angstrom thereby a third Ag layer 23c is formed. Heating is performed inert gas atmosphere at 450-600 deg.C for 5-10min and Ag and Zn are diffused into the p type GaP crystal thereby an ohmic contact electrode is constituted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9091081A JPS57206024A (en) | 1981-06-15 | 1981-06-15 | Method of forming electrode onto compound semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9091081A JPS57206024A (en) | 1981-06-15 | 1981-06-15 | Method of forming electrode onto compound semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57206024A true JPS57206024A (en) | 1982-12-17 |
Family
ID=14011558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9091081A Pending JPS57206024A (en) | 1981-06-15 | 1981-06-15 | Method of forming electrode onto compound semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57206024A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6024074A (en) * | 1983-05-13 | 1985-02-06 | アメリカ合衆国 | Gallium arsenide semiconductor device and method of producing same |
JPH01307278A (en) * | 1988-06-04 | 1989-12-12 | Nippon Mining Co Ltd | Solar cell |
CN111769251A (en) * | 2020-04-10 | 2020-10-13 | 上海大学 | Method for protecting metal electrode |
-
1981
- 1981-06-15 JP JP9091081A patent/JPS57206024A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6024074A (en) * | 1983-05-13 | 1985-02-06 | アメリカ合衆国 | Gallium arsenide semiconductor device and method of producing same |
JPH01307278A (en) * | 1988-06-04 | 1989-12-12 | Nippon Mining Co Ltd | Solar cell |
CN111769251A (en) * | 2020-04-10 | 2020-10-13 | 上海大学 | Method for protecting metal electrode |
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