JPS5720458A - Cooling system for package of electronic circuit - Google Patents
Cooling system for package of electronic circuitInfo
- Publication number
- JPS5720458A JPS5720458A JP9435380A JP9435380A JPS5720458A JP S5720458 A JPS5720458 A JP S5720458A JP 9435380 A JP9435380 A JP 9435380A JP 9435380 A JP9435380 A JP 9435380A JP S5720458 A JPS5720458 A JP S5720458A
- Authority
- JP
- Japan
- Prior art keywords
- package
- fan
- electronic circuit
- cooling system
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
PURPOSE:To simplify the maintenance of a cooling fan by a method wherein a fan package which can be mounted or dismounted to or from a shelf in accordance with the same specification as th package of the electronic circuit is prepared, and the electronic circuit is cooled. CONSTITUTION:The fan package 62 consists of a motor 52, the fan 51 and a rectifying cover 71, sucks F a cooling air by means of the fan 51, sends an air to a circuit element mounted to the package 22, which generates a large amount of heat, and cools the element, and discharges G a hot air. The circuit package, which generates a small amount of heat, is cooled at low cost through a natural convection H. According to this constitution, a forced cooling system can be introduced at low cost to places where heat generation is often dispersed while maintenance is also easy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9435380A JPS5720458A (en) | 1980-07-10 | 1980-07-10 | Cooling system for package of electronic circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9435380A JPS5720458A (en) | 1980-07-10 | 1980-07-10 | Cooling system for package of electronic circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5720458A true JPS5720458A (en) | 1982-02-02 |
Family
ID=14107913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9435380A Pending JPS5720458A (en) | 1980-07-10 | 1980-07-10 | Cooling system for package of electronic circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5720458A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58148988U (en) * | 1982-03-31 | 1983-10-06 | 三洋電機株式会社 | circuit board cooling device |
JPS61203784U (en) * | 1985-06-10 | 1986-12-22 | ||
US4899254A (en) * | 1987-07-22 | 1990-02-06 | Tandem Computers Incorporated | Electronic module interconnection system |
US4901200A (en) * | 1987-10-14 | 1990-02-13 | Schroff Gmbh | Insertable housing |
US4931904A (en) * | 1989-05-30 | 1990-06-05 | Motorola, Inc. | Localized circuit card cooling device |
US4967311A (en) * | 1987-07-22 | 1990-10-30 | Tandem Computers Incorporated | Electronic module interconnection system |
EP0447819A2 (en) * | 1990-03-19 | 1991-09-25 | International Business Machines Corporation | Multileveled electronic assembly with cooling means |
US5208730A (en) * | 1991-06-27 | 1993-05-04 | Compaq Computer Corporation | Computer cooling fan vibration isolation apparatus |
US5237484A (en) * | 1991-07-08 | 1993-08-17 | Tandem Computers Incorporated | Apparatus for cooling a plurality of electronic modules |
US5289363A (en) * | 1991-07-08 | 1994-02-22 | Tandem Computers, Inc. | Modular power supply arrangement with cooling |
JP2020126923A (en) * | 2019-02-04 | 2020-08-20 | 富士ゼロックス株式会社 | Air blowing control device and air blowing control program |
-
1980
- 1980-07-10 JP JP9435380A patent/JPS5720458A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58148988U (en) * | 1982-03-31 | 1983-10-06 | 三洋電機株式会社 | circuit board cooling device |
JPS6342559Y2 (en) * | 1982-03-31 | 1988-11-08 | ||
JPS61203784U (en) * | 1985-06-10 | 1986-12-22 | ||
JPH0430634Y2 (en) * | 1985-06-10 | 1992-07-23 | ||
US4967311A (en) * | 1987-07-22 | 1990-10-30 | Tandem Computers Incorporated | Electronic module interconnection system |
US4899254A (en) * | 1987-07-22 | 1990-02-06 | Tandem Computers Incorporated | Electronic module interconnection system |
US4901200A (en) * | 1987-10-14 | 1990-02-13 | Schroff Gmbh | Insertable housing |
US4931904A (en) * | 1989-05-30 | 1990-06-05 | Motorola, Inc. | Localized circuit card cooling device |
EP0447819A2 (en) * | 1990-03-19 | 1991-09-25 | International Business Machines Corporation | Multileveled electronic assembly with cooling means |
US5208730A (en) * | 1991-06-27 | 1993-05-04 | Compaq Computer Corporation | Computer cooling fan vibration isolation apparatus |
US5237484A (en) * | 1991-07-08 | 1993-08-17 | Tandem Computers Incorporated | Apparatus for cooling a plurality of electronic modules |
US5289363A (en) * | 1991-07-08 | 1994-02-22 | Tandem Computers, Inc. | Modular power supply arrangement with cooling |
JP2020126923A (en) * | 2019-02-04 | 2020-08-20 | 富士ゼロックス株式会社 | Air blowing control device and air blowing control program |
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