JPS57197435A - Semiconductor pressure converter - Google Patents

Semiconductor pressure converter

Info

Publication number
JPS57197435A
JPS57197435A JP8096281A JP8096281A JPS57197435A JP S57197435 A JPS57197435 A JP S57197435A JP 8096281 A JP8096281 A JP 8096281A JP 8096281 A JP8096281 A JP 8096281A JP S57197435 A JPS57197435 A JP S57197435A
Authority
JP
Japan
Prior art keywords
unit
metallic
case
cover
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8096281A
Other languages
Japanese (ja)
Inventor
Kenji Tabuchi
Terumi Nakazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8096281A priority Critical patent/JPS57197435A/en
Publication of JPS57197435A publication Critical patent/JPS57197435A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/003—Fluidic connecting means using a detachable interface or adapter between the process medium and the pressure gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

PURPOSE:To provide the performance immunized against electromagnetic wave interference, by locating a strain guage unit used as a pressure detector for car and an amplifying circuit board in two stories in a case, separating them via a metallic base and surrounding them with a metallic cap and a metallic cover respectively. CONSTITUTION:A case 14 is formed with a main body of case 10 and a case cover 12, and a strain guage unit 16 detecting the pressure change and converting it into an electric signal, and a circuit board 18 are provided. The unit 16 is fitted at the lower surface of the main body 10 and the strain guage 26 is suspended on a small cylinder 24 in a unit casing 22 linked to a linking tube 20. The board 18 is crossingly located at the upper side of the unit 16 via a metallic base 32 so as to divide the case into upper and lower two parts. The unit 16 and the board 18 are shielded independently to the base 32 with the metallic cap 44 and the metallic cover 46. The cap 44 is formed by surrounding the three sides of the casing 22 and the cover 46 is located along the inner wall of the cover 12 by folding both sides to the upper side of the base 32.
JP8096281A 1981-05-29 1981-05-29 Semiconductor pressure converter Pending JPS57197435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8096281A JPS57197435A (en) 1981-05-29 1981-05-29 Semiconductor pressure converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8096281A JPS57197435A (en) 1981-05-29 1981-05-29 Semiconductor pressure converter

Publications (1)

Publication Number Publication Date
JPS57197435A true JPS57197435A (en) 1982-12-03

Family

ID=13733133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8096281A Pending JPS57197435A (en) 1981-05-29 1981-05-29 Semiconductor pressure converter

Country Status (1)

Country Link
JP (1) JPS57197435A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149938A (en) * 1984-01-16 1985-08-07 Nippon Denso Co Ltd Manufacture of semiconductor pressure sensor
JPS60207030A (en) * 1984-03-09 1985-10-18 シーメンス、アクチエンゲゼルシヤフト Pressure or differential pressure measuring device
EP0658754A1 (en) * 1993-12-14 1995-06-21 ENVEC Mess- und Regeltechnik GmbH + Co. Pressure measuring arrangement

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149938A (en) * 1984-01-16 1985-08-07 Nippon Denso Co Ltd Manufacture of semiconductor pressure sensor
JPS60207030A (en) * 1984-03-09 1985-10-18 シーメンス、アクチエンゲゼルシヤフト Pressure or differential pressure measuring device
JPH0580610B2 (en) * 1984-03-09 1993-11-09 Siemens Ag
EP0658754A1 (en) * 1993-12-14 1995-06-21 ENVEC Mess- und Regeltechnik GmbH + Co. Pressure measuring arrangement
US5551303A (en) * 1993-12-14 1996-09-03 Envec Mess-Und Regeltechnik Gmbh + Co. Pressure-measuring arrangement with conductive foil shielding

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