JPS57188690A - Recovering method for gold from waste liquid of stripping of gold plating - Google Patents

Recovering method for gold from waste liquid of stripping of gold plating

Info

Publication number
JPS57188690A
JPS57188690A JP7160981A JP7160981A JPS57188690A JP S57188690 A JPS57188690 A JP S57188690A JP 7160981 A JP7160981 A JP 7160981A JP 7160981 A JP7160981 A JP 7160981A JP S57188690 A JPS57188690 A JP S57188690A
Authority
JP
Japan
Prior art keywords
gold
waste liquid
stripping
oxidizing agent
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7160981A
Other languages
Japanese (ja)
Inventor
Masao Konno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7160981A priority Critical patent/JPS57188690A/en
Publication of JPS57188690A publication Critical patent/JPS57188690A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Abstract

PURPOSE: To recover gold easily with good current efficiency in the stage of recovering the gold in waste liquid of stripping of gold plating which is alkaline and contains an oxidizing agent by electrolysis by adding H2O2 beforehand to said liquid and heating the same.
CONSTITUTION: ≥0.5wt% H2O2 is added to the waste liquid of stripping of gold plating which contains an oxidizing agent that reduces H2O2 in an alkaline bath, and contains ≥1 component of any of Cu, Ni, Fe in 10ppm liquid concns. After this liquid is heated for ≥5min at 30W90°C, it is electrolyzed. Here, if the heating temp. is below the lower limit, the rate of reaction is too low and in excess of the upper limit, the rate of evaporation is too high, and these are undesirable for working conditions. The oxidizing agent in the waste liquid is reduced by H2O2 and the electric current to be used for the electrolysis is not more wastefully consumed for the reduction of the oxidizing agent. The decrease in the current efficiency owing to the presence of the excess H2O2 above the oxidation- reduction equiv. is prevented by the heating.
COPYRIGHT: (C)1982,JPO&Japio
JP7160981A 1981-05-13 1981-05-13 Recovering method for gold from waste liquid of stripping of gold plating Pending JPS57188690A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7160981A JPS57188690A (en) 1981-05-13 1981-05-13 Recovering method for gold from waste liquid of stripping of gold plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7160981A JPS57188690A (en) 1981-05-13 1981-05-13 Recovering method for gold from waste liquid of stripping of gold plating

Publications (1)

Publication Number Publication Date
JPS57188690A true JPS57188690A (en) 1982-11-19

Family

ID=13465556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7160981A Pending JPS57188690A (en) 1981-05-13 1981-05-13 Recovering method for gold from waste liquid of stripping of gold plating

Country Status (1)

Country Link
JP (1) JPS57188690A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000001863A3 (en) * 1998-07-01 2000-06-15 Otb Oberflaechentechnik Berlin Method for recovering precious metals
CN105164317A (en) * 2013-05-31 2015-12-16 朝日浦力环境科技有限公司 Method and device for treating iodine-containing etching solution which contains au

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000001863A3 (en) * 1998-07-01 2000-06-15 Otb Oberflaechentechnik Berlin Method for recovering precious metals
CN105164317A (en) * 2013-05-31 2015-12-16 朝日浦力环境科技有限公司 Method and device for treating iodine-containing etching solution which contains au

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