JPS57176762A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57176762A JPS57176762A JP6088881A JP6088881A JPS57176762A JP S57176762 A JPS57176762 A JP S57176762A JP 6088881 A JP6088881 A JP 6088881A JP 6088881 A JP6088881 A JP 6088881A JP S57176762 A JPS57176762 A JP S57176762A
- Authority
- JP
- Japan
- Prior art keywords
- film
- prevents
- electrode
- reaction
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- ZXEYZECDXFPJRJ-UHFFFAOYSA-N $l^{3}-silane;platinum Chemical compound [SiH3].[Pt] ZXEYZECDXFPJRJ-UHFFFAOYSA-N 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 abstract 2
- 229910021339 platinum silicide Inorganic materials 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 1
- 229920005591 polysilicon Polymers 0.000 abstract 1
- 229910021332 silicide Inorganic materials 0.000 abstract 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
Abstract
PURPOSE:To implement a high speed operation with a high yield rate and high reliability, in a bipolar transistor with a Schottky barrier diode, by providing a wiring metal film through a film which prevents the reaction between metal silicide and wiring metal. CONSTITUTION:An SiO2 film 14 is provided on a P type base region 12 in an N type Si region 11. An Al electrode 18 is provided on a platinum silicide film 16 at the part of Schottky barrier diode (SBD) through a film 17 comprising Ti and W which prevents the reaction with the platinum silicide. Meanwhile, a polysilicon film 15 including high impurity garium is provided on an N<+> type emitter region 13. An Al electrode 18 is provided thereon through a film 17 comprising Ti and W. Thus a fine pattern, which is operated at a high speed, and multilayer wiring can be provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6088881A JPS57176762A (en) | 1981-04-22 | 1981-04-22 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6088881A JPS57176762A (en) | 1981-04-22 | 1981-04-22 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57176762A true JPS57176762A (en) | 1982-10-30 |
Family
ID=13155343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6088881A Pending JPS57176762A (en) | 1981-04-22 | 1981-04-22 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57176762A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59121872A (en) * | 1982-12-15 | 1984-07-14 | Fujitsu Ltd | Semiconductor device |
JPS60140847A (en) * | 1983-12-28 | 1985-07-25 | Fujitsu Ltd | Semiconductor device |
JPS60169169A (en) * | 1984-02-13 | 1985-09-02 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
JPS60241262A (en) * | 1984-05-11 | 1985-11-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Hetero structure bipolar transistor |
JPS6233457A (en) * | 1985-08-06 | 1987-02-13 | Nec Corp | Semiconductor integrated circuit device |
US5272357A (en) * | 1989-11-30 | 1993-12-21 | Canon Kabushiki Kaisha | Semiconductor device and electronic device by use of the semiconductor |
WO2003021683A1 (en) * | 2001-08-28 | 2003-03-13 | Sony Corporation | Semiconductor device and its manufacturing method |
US7166875B2 (en) | 1996-03-01 | 2007-01-23 | Micron Technology, Inc. | Vertical diode structures |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5146869A (en) * | 1974-10-18 | 1976-04-21 | Mitsubishi Electric Corp | Handotaisochino denkyoku |
JPS5177076A (en) * | 1974-12-27 | 1976-07-03 | Fujitsu Ltd | HANDOTAISOCHINOSEIZOHOHO |
JPS55153329A (en) * | 1979-05-18 | 1980-11-29 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1981
- 1981-04-22 JP JP6088881A patent/JPS57176762A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5146869A (en) * | 1974-10-18 | 1976-04-21 | Mitsubishi Electric Corp | Handotaisochino denkyoku |
JPS5177076A (en) * | 1974-12-27 | 1976-07-03 | Fujitsu Ltd | HANDOTAISOCHINOSEIZOHOHO |
JPS55153329A (en) * | 1979-05-18 | 1980-11-29 | Fujitsu Ltd | Manufacture of semiconductor device |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59121872A (en) * | 1982-12-15 | 1984-07-14 | Fujitsu Ltd | Semiconductor device |
JPH0441498B2 (en) * | 1983-12-28 | 1992-07-08 | Fujitsu Ltd | |
JPS60140847A (en) * | 1983-12-28 | 1985-07-25 | Fujitsu Ltd | Semiconductor device |
JPS60169169A (en) * | 1984-02-13 | 1985-09-02 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
JPH0550129B2 (en) * | 1984-02-13 | 1993-07-28 | Fujitsu Ltd | |
JPS60241262A (en) * | 1984-05-11 | 1985-11-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Hetero structure bipolar transistor |
JPS6233457A (en) * | 1985-08-06 | 1987-02-13 | Nec Corp | Semiconductor integrated circuit device |
US5272357A (en) * | 1989-11-30 | 1993-12-21 | Canon Kabushiki Kaisha | Semiconductor device and electronic device by use of the semiconductor |
US7279725B2 (en) | 1996-03-01 | 2007-10-09 | Micron Technology, Inc. | Vertical diode structures |
US8034716B2 (en) | 1996-03-01 | 2011-10-11 | Micron Technology, Inc. | Semiconductor structures including vertical diode structures and methods for making the same |
US7166875B2 (en) | 1996-03-01 | 2007-01-23 | Micron Technology, Inc. | Vertical diode structures |
US7170103B2 (en) * | 1996-03-01 | 2007-01-30 | Micron Technology, Inc. | Wafer with vertical diode structures |
US7563666B2 (en) | 1996-03-01 | 2009-07-21 | Micron Technology, Inc. | Semiconductor structures including vertical diode structures and methods of making the same |
WO2003021683A1 (en) * | 2001-08-28 | 2003-03-13 | Sony Corporation | Semiconductor device and its manufacturing method |
CN100361312C (en) * | 2001-08-28 | 2008-01-09 | 索尼株式会社 | Semiconductor device and method for manufacturing the same |
US7271046B2 (en) | 2001-08-28 | 2007-09-18 | Sony Corporation | Method of making a semiconductor device in which a bipolar transistor and a metal silicide layer are formed on a substrate |
KR100910118B1 (en) * | 2001-08-28 | 2009-08-03 | 소니 가부시끼 가이샤 | Semiconductor device and its manufacturing method |
US7064417B2 (en) | 2001-08-28 | 2006-06-20 | Sony Corporation | Semiconductor device including a bipolar transistor |
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