JPS57171690A - Plating method - Google Patents

Plating method

Info

Publication number
JPS57171690A
JPS57171690A JP5613281A JP5613281A JPS57171690A JP S57171690 A JPS57171690 A JP S57171690A JP 5613281 A JP5613281 A JP 5613281A JP 5613281 A JP5613281 A JP 5613281A JP S57171690 A JPS57171690 A JP S57171690A
Authority
JP
Japan
Prior art keywords
roller
substance
treated
plating
plating liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5613281A
Other languages
Japanese (ja)
Inventor
Tokio Osaki
Isamu Takemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KARUTO KK
Original Assignee
KARUTO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KARUTO KK filed Critical KARUTO KK
Priority to JP5613281A priority Critical patent/JPS57171690A/en
Publication of JPS57171690A publication Critical patent/JPS57171690A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To easily perform desired plating to the surface of a substance to be treated, by pressing the surface of the substance to be treated, by use of a roller to which a plating liquid and electrically conducted, and also turning and moving it.
CONSTITUTION: Plating is performed by feeding power to a roller 1 consistuted of a roller core 1a consisting of a metal, carbon, etc., and a solution impregnating material 1b wound round its outside circumference to necessary thickness, to which a plating liquid has been fed, turning this roller 1, pressing the surface of a substance to be treated 2, and moving the roller 1. The impregnating material 1b of said roller 1 is impregnated with a plating liquid obtained by ionizing a desired metal. Also, to the roller 1 side and the substance to be treated 2 side, the positive pole side of a DC power supply and the negative pole side are connected respectively, and plating is performed in electrically-conducting. As a result, desired plating can be performed easily to the surface of the substance to be treated, by only making the roller contact with the substance to be treated, and a plating liquid tank is not required, therefore, the quantity of the plating liquid can be saved.
COPYRIGHT: (C)1982,JPO&Japio
JP5613281A 1981-04-13 1981-04-13 Plating method Pending JPS57171690A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5613281A JPS57171690A (en) 1981-04-13 1981-04-13 Plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5613281A JPS57171690A (en) 1981-04-13 1981-04-13 Plating method

Publications (1)

Publication Number Publication Date
JPS57171690A true JPS57171690A (en) 1982-10-22

Family

ID=13018545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5613281A Pending JPS57171690A (en) 1981-04-13 1981-04-13 Plating method

Country Status (1)

Country Link
JP (1) JPS57171690A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999041434A3 (en) * 1998-02-12 1999-10-14 Acm Res Inc Plating apparatus and method
US7136173B2 (en) 1998-07-09 2006-11-14 Acm Research, Inc. Method and apparatus for end-point detection
JP2009228121A (en) * 2008-03-25 2009-10-08 Toshiba Corp Coating method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999041434A3 (en) * 1998-02-12 1999-10-14 Acm Res Inc Plating apparatus and method
KR100474746B1 (en) * 1998-02-12 2005-03-08 에이씨엠 리서치, 인코포레이티드 Plating apparatus and method
US7136173B2 (en) 1998-07-09 2006-11-14 Acm Research, Inc. Method and apparatus for end-point detection
JP2009228121A (en) * 2008-03-25 2009-10-08 Toshiba Corp Coating method
JP4564545B2 (en) * 2008-03-25 2010-10-20 株式会社東芝 Coating method

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