JPS57171690A - Plating method - Google Patents
Plating methodInfo
- Publication number
- JPS57171690A JPS57171690A JP5613281A JP5613281A JPS57171690A JP S57171690 A JPS57171690 A JP S57171690A JP 5613281 A JP5613281 A JP 5613281A JP 5613281 A JP5613281 A JP 5613281A JP S57171690 A JPS57171690 A JP S57171690A
- Authority
- JP
- Japan
- Prior art keywords
- roller
- substance
- treated
- plating
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To easily perform desired plating to the surface of a substance to be treated, by pressing the surface of the substance to be treated, by use of a roller to which a plating liquid and electrically conducted, and also turning and moving it.
CONSTITUTION: Plating is performed by feeding power to a roller 1 consistuted of a roller core 1a consisting of a metal, carbon, etc., and a solution impregnating material 1b wound round its outside circumference to necessary thickness, to which a plating liquid has been fed, turning this roller 1, pressing the surface of a substance to be treated 2, and moving the roller 1. The impregnating material 1b of said roller 1 is impregnated with a plating liquid obtained by ionizing a desired metal. Also, to the roller 1 side and the substance to be treated 2 side, the positive pole side of a DC power supply and the negative pole side are connected respectively, and plating is performed in electrically-conducting. As a result, desired plating can be performed easily to the surface of the substance to be treated, by only making the roller contact with the substance to be treated, and a plating liquid tank is not required, therefore, the quantity of the plating liquid can be saved.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5613281A JPS57171690A (en) | 1981-04-13 | 1981-04-13 | Plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5613281A JPS57171690A (en) | 1981-04-13 | 1981-04-13 | Plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57171690A true JPS57171690A (en) | 1982-10-22 |
Family
ID=13018545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5613281A Pending JPS57171690A (en) | 1981-04-13 | 1981-04-13 | Plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57171690A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999041434A3 (en) * | 1998-02-12 | 1999-10-14 | Acm Res Inc | Plating apparatus and method |
US7136173B2 (en) | 1998-07-09 | 2006-11-14 | Acm Research, Inc. | Method and apparatus for end-point detection |
JP2009228121A (en) * | 2008-03-25 | 2009-10-08 | Toshiba Corp | Coating method |
-
1981
- 1981-04-13 JP JP5613281A patent/JPS57171690A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999041434A3 (en) * | 1998-02-12 | 1999-10-14 | Acm Res Inc | Plating apparatus and method |
KR100474746B1 (en) * | 1998-02-12 | 2005-03-08 | 에이씨엠 리서치, 인코포레이티드 | Plating apparatus and method |
US7136173B2 (en) | 1998-07-09 | 2006-11-14 | Acm Research, Inc. | Method and apparatus for end-point detection |
JP2009228121A (en) * | 2008-03-25 | 2009-10-08 | Toshiba Corp | Coating method |
JP4564545B2 (en) * | 2008-03-25 | 2010-10-20 | 株式会社東芝 | Coating method |
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