JPS57170560U - - Google Patents

Info

Publication number: JPS57170560U
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP5656881U

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-04-21

Filing date

1981-04-21

Publication date

1982-10-27

1981-04-21 Application filed filed Critical

1981-04-21 Priority to JP5656881U priority Critical patent/JPS57170560U/ja

1982-10-27 Publication of JPS57170560U publication Critical patent/JPS57170560U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Lead Frames For Integrated Circuits (AREA)

JP5656881U 1981-04-21 1981-04-21 Pending JPS57170560U (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP5656881U JPS57170560U (ja)	1981-04-21	1981-04-21

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP5656881U JPS57170560U (ja)	1981-04-21	1981-04-21

Publications (1)

Publication Number	Publication Date
JPS57170560U true JPS57170560U (ja)	1982-10-27

Family

ID=29853070

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP5656881U Pending JPS57170560U (ja)	1981-04-21	1981-04-21

Country Status (1)

Country	Link
JP (1)	JPS57170560U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2010028149A (ja) *	2005-05-30	2010-02-04	Samsung Electro-Mechanics Co Ltd	高出力ｌｅｄパッケージの製造方法
JP2013098199A (ja) *	2011-10-28	2013-05-20	Mitsubishi Electric Corp	電力用半導体装置および電力用半導体装置の製造方法
JP2015170787A (ja) *	2014-03-10	2015-09-28	新電元工業株式会社	樹脂封止型半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5619642A (en) *	1979-07-27	1981-02-24	Hitachi Ltd	Resin-sealed semiconductor device
JPS57114266A (en) *	1981-01-07	1982-07-16	Mitsubishi Electric Corp	Resin-sealed semiconductor device

1981
- 1981-04-21 JP JP5656881U patent/JPS57170560U/ja active Pending

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5619642A (en) *	1979-07-27	1981-02-24	Hitachi Ltd	Resin-sealed semiconductor device
JPS57114266A (en) *	1981-01-07	1982-07-16	Mitsubishi Electric Corp	Resin-sealed semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2010028149A (ja) *	2005-05-30	2010-02-04	Samsung Electro-Mechanics Co Ltd	高出力ｌｅｄパッケージの製造方法
JP2013098199A (ja) *	2011-10-28	2013-05-20	Mitsubishi Electric Corp	電力用半導体装置および電力用半導体装置の製造方法
JP2015170787A (ja) *	2014-03-10	2015-09-28	新電元工業株式会社	樹脂封止型半導体装置

Publication	Publication Date	Title
FR2500333B1 (ja)	1986-08-22
DE3204567C2 (ja)	1985-03-07
DE3249818A1 (ja)	1986-03-20
CH655550B (ja)	1986-04-30
CH655571B (ja)	1986-04-30
FR2507554B3 (ja)	1984-03-02
CH655527B (ja)	1986-04-30
FR2497952B1 (ja)	1984-07-13
FR2500752B1 (ja)	1984-12-28
CH655520B (ja)	1986-04-30
FR2500635B1 (ja)	1985-03-15
FR2500833B1 (ja)	1983-12-23
FR2513747B1 (ja)	1983-12-02
FR2500177B1 (ja)	1985-03-08
FR2501468B3 (ja)	1984-01-06
FR2501020B1 (ja)	1984-11-16
FR2501749B3 (ja)	1984-01-13
FR2497790B1 (ja)	1985-03-29
FR2498137B3 (ja)	1982-12-10
FR2497694B1 (ja)	1984-03-23
FR2500078B1 (ja)	1984-03-02
FR2500023B1 (ja)	1983-05-06
FR2497906B1 (ja)	1984-02-10
FR2500317B3 (ja)	1983-02-11
FR2500258B1 (ja)	1984-02-10

JPS57170560U - - Google Patents

Info

Links

Classifications

Landscapes

Priority Applications (1)

Applications Claiming Priority (1)

Publications (1)

Family

ID=29853070

Family Applications (1)

Country Status (1)

Cited By (3)

Citations (2)

Patent Citations (2)

Cited By (3)

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