JPS57167678A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57167678A
JPS57167678A JP5169581A JP5169581A JPS57167678A JP S57167678 A JPS57167678 A JP S57167678A JP 5169581 A JP5169581 A JP 5169581A JP 5169581 A JP5169581 A JP 5169581A JP S57167678 A JPS57167678 A JP S57167678A
Authority
JP
Japan
Prior art keywords
region
film
injected
type impurities
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5169581A
Other languages
Japanese (ja)
Inventor
Toru Furuyama
Fujio Masuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5169581A priority Critical patent/JPS57167678A/en
Publication of JPS57167678A publication Critical patent/JPS57167678A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)

Abstract

PURPOSE:To dispense with the unnecessary area and to increase the degree of integration for the subject semiconductor device by a method wherein a source and drain region and a channel region are formed using a self-aligning method. CONSTITUTION:A semiconductor region 52, wherein P type impurities are selectively injected, is additionally formed on a P type substrate 1, and a field oxide film 53 is formed on the surface of the region 52. On the above film 53, a conductive film 54, whereon N type impurities are injected on the whole surface, and an insulating film 55 are formed. Then, an etching is selectively peformed on the expected region whereon a transistor channel of the first insulating film 54 will be formed, and another etching is performed on the surface of the semiconductor substrate using the remaining insulating film 55 as a mask. Then, the exposed surface of the semiconductor substrate is oxidized, a gate oxide film 56 is formed, a polycrystalline silicon is formed on the film 56, and a gate electrode 57 is formed. Besides, N type impurities are injected on the substrate surface from the conductive film 54 by performing a diffusion process, and an N<+> region 58 is formed. This region 58 is turned into the source and drain of the transistor.
JP5169581A 1981-04-08 1981-04-08 Manufacture of semiconductor device Pending JPS57167678A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5169581A JPS57167678A (en) 1981-04-08 1981-04-08 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5169581A JPS57167678A (en) 1981-04-08 1981-04-08 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57167678A true JPS57167678A (en) 1982-10-15

Family

ID=12894030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5169581A Pending JPS57167678A (en) 1981-04-08 1981-04-08 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57167678A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61125175A (en) * 1984-11-22 1986-06-12 Nec Corp Mis type semiconductor integrated circuit device and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61125175A (en) * 1984-11-22 1986-06-12 Nec Corp Mis type semiconductor integrated circuit device and manufacture thereof

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