JPS57164987A - Anticorrosive for copper - Google Patents

Anticorrosive for copper

Info

Publication number
JPS57164987A
JPS57164987A JP5050081A JP5050081A JPS57164987A JP S57164987 A JPS57164987 A JP S57164987A JP 5050081 A JP5050081 A JP 5050081A JP 5050081 A JP5050081 A JP 5050081A JP S57164987 A JPS57164987 A JP S57164987A
Authority
JP
Japan
Prior art keywords
anticorrosive
benzimidazole
thiazolyl
concn
toxicity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5050081A
Other languages
Japanese (ja)
Other versions
JPS5925034B2 (en
Inventor
Shinji Ano
Koji Takemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kurita Water Industries Ltd
Original Assignee
Kurita Water Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurita Water Industries Ltd filed Critical Kurita Water Industries Ltd
Priority to JP5050081A priority Critical patent/JPS5925034B2/en
Publication of JPS57164987A publication Critical patent/JPS57164987A/en
Publication of JPS5925034B2 publication Critical patent/JPS5925034B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/16—Sulfur-containing compounds
    • C23F11/165—Heterocyclic compounds containing sulfur as hetero atom

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

PURPOSE:To usefully utilize an anticorrosive in the food manufacturing industry in which the toxicity of the anticorrosive is a problem, a heat medium used in a solar system, a refrigerant circulating system, etc. by using 2-(4-thiazolyl)-benzimidazole as the principal component. CONSTITUTION:As the principal component of an anticorrosive for copper 2- (4-thiazolyl)-benzimidazole or a salt thereof such as amine salt is used. When the concn. of the anticorrosive added to a water system to be protected from corrosion is >=0.5ppm as thiabenzimidazole, the effect is produced. When the concn. exceeds 50ppm, the effect becomes constant, so it is uneconomical to add the anticorrosive by >50ppm. 2-(4-Thiazolyl)-benzimidazole and salts thereof recognized as food additives do not cause the problem of toxicity at all.
JP5050081A 1981-04-06 1981-04-06 Corrosion inhibitor for copper Expired JPS5925034B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5050081A JPS5925034B2 (en) 1981-04-06 1981-04-06 Corrosion inhibitor for copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5050081A JPS5925034B2 (en) 1981-04-06 1981-04-06 Corrosion inhibitor for copper

Publications (2)

Publication Number Publication Date
JPS57164987A true JPS57164987A (en) 1982-10-09
JPS5925034B2 JPS5925034B2 (en) 1984-06-13

Family

ID=12860659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5050081A Expired JPS5925034B2 (en) 1981-04-06 1981-04-06 Corrosion inhibitor for copper

Country Status (1)

Country Link
JP (1) JPS5925034B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0490161A2 (en) * 1990-12-08 1992-06-17 BASF Aktiengesellschaft A method for protecting surfaces of copper or a copper alloy from corrosion
JP2015193876A (en) * 2014-03-31 2015-11-05 栗田工業株式会社 Method for inhibiting corrosion of copper-based member and corrosion inhibitor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6330399B2 (en) * 2014-03-18 2018-05-30 栗田工業株式会社 Nitrifying bacteria inhibitor and method for inhibiting nitrifying bacteria

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0490161A2 (en) * 1990-12-08 1992-06-17 BASF Aktiengesellschaft A method for protecting surfaces of copper or a copper alloy from corrosion
EP0490161A3 (en) * 1990-12-08 1993-02-03 Basf Aktiengesellschaft A method for protecting surfaces of copper or a copper alloy from corrosion
JP2015193876A (en) * 2014-03-31 2015-11-05 栗田工業株式会社 Method for inhibiting corrosion of copper-based member and corrosion inhibitor

Also Published As

Publication number Publication date
JPS5925034B2 (en) 1984-06-13

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