JPS57158271A - Film extrusion-coating resin composition - Google Patents
Film extrusion-coating resin compositionInfo
- Publication number
- JPS57158271A JPS57158271A JP4322281A JP4322281A JPS57158271A JP S57158271 A JPS57158271 A JP S57158271A JP 4322281 A JP4322281 A JP 4322281A JP 4322281 A JP4322281 A JP 4322281A JP S57158271 A JPS57158271 A JP S57158271A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- thermoplastic resin
- film
- powder paint
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title abstract 3
- 238000007765 extrusion coating Methods 0.000 title abstract 2
- 229920005992 thermoplastic resin Polymers 0.000 abstract 5
- 239000003822 epoxy resin Substances 0.000 abstract 4
- 229920000647 polyepoxide Polymers 0.000 abstract 4
- 239000003973 paint Substances 0.000 abstract 3
- 239000000843 powder Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- -1 polyethylene terephthalate Polymers 0.000 abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- 238000001125 extrusion Methods 0.000 abstract 1
- 229920006287 phenoxy resin Polymers 0.000 abstract 1
- 239000013034 phenoxy resin Substances 0.000 abstract 1
- 229920001707 polybutylene terephthalate Polymers 0.000 abstract 1
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract 1
- 239000005020 polyethylene terephthalate Substances 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 239000009719 polyimide resin Substances 0.000 abstract 1
Landscapes
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: An extrusion-coating resin composition giving a film with a high softening temp. and good appearance, which is prepd. by compounding a thermoplastic resin with a thermosetting epoxy resin for a powder paint.
CONSTITUTION: A thermoplastic resin is compounded with a thermosetting epoxy resin for a powder paint. A polyethylene terephthalate resin, polybutylene terephthalate resin, phenoxy resin, and aliph. polyimide resin, having good extrudability, electrical insulating property and miscibility with the epoxy resin for a powder paint, are the most suitable resin as the thermoplastic resin to be used. A proportion or the epoxy resin to be compounded depends or the film extrudability of the thermoplastic resin used and is generally pref. 5W100pts.wt. per 100pts.wt. thermoplastic resin. Undesirably, with less than 5pts.wt., the softening point of the resin composition obtd. is not enhanced, while with more than 100pts.wt., film extrusion becomes difficult.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4322281A JPS57158271A (en) | 1981-03-26 | 1981-03-26 | Film extrusion-coating resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4322281A JPS57158271A (en) | 1981-03-26 | 1981-03-26 | Film extrusion-coating resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57158271A true JPS57158271A (en) | 1982-09-30 |
Family
ID=12657880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4322281A Pending JPS57158271A (en) | 1981-03-26 | 1981-03-26 | Film extrusion-coating resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57158271A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0720901A1 (en) * | 1994-12-29 | 1996-07-10 | " 3P" Licensing B.V. | Process for encapsulating an electronic component, an electronic component thus encapsulated, and encapsulating material designed therefor |
| KR100539483B1 (en) * | 2002-07-24 | 2005-12-28 | 주식회사 유진폴리텍크 | Tape For Sewing |
| US7776440B2 (en) * | 2006-01-26 | 2010-08-17 | Chuo Hatsujo Kabushiki Kaisha | Spring coated with powder coating of epoxy resin and thermoplastic resin |
-
1981
- 1981-03-26 JP JP4322281A patent/JPS57158271A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0720901A1 (en) * | 1994-12-29 | 1996-07-10 | " 3P" Licensing B.V. | Process for encapsulating an electronic component, an electronic component thus encapsulated, and encapsulating material designed therefor |
| NL9402233A (en) * | 1994-12-29 | 1996-08-01 | 3P Licensing Bv | Method for encapsulating an electronic component, an electronic component thus encapsulated and plastic material intended therefor. |
| KR100539483B1 (en) * | 2002-07-24 | 2005-12-28 | 주식회사 유진폴리텍크 | Tape For Sewing |
| US7776440B2 (en) * | 2006-01-26 | 2010-08-17 | Chuo Hatsujo Kabushiki Kaisha | Spring coated with powder coating of epoxy resin and thermoplastic resin |
| US8192840B2 (en) | 2006-01-26 | 2012-06-05 | Chuo Hatsujo Kabushiki Kaisha | Spring with high durability and method of coating the same |
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