JPS57158236A - Production of electroless-plated polyamide resin molding - Google Patents
Production of electroless-plated polyamide resin moldingInfo
- Publication number
- JPS57158236A JPS57158236A JP4250681A JP4250681A JPS57158236A JP S57158236 A JPS57158236 A JP S57158236A JP 4250681 A JP4250681 A JP 4250681A JP 4250681 A JP4250681 A JP 4250681A JP S57158236 A JPS57158236 A JP S57158236A
- Authority
- JP
- Japan
- Prior art keywords
- molding
- polyamide resin
- silica
- electroless
- fine powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Chemically Coating (AREA)
Abstract
PURPOSE: To produce the titled molding excellent in adhesion, brilliancy, light resistance and antistatic property, by applying electroless platings to a molding of a polyamide resin composition containing a specified silica.
CONSTITUTION: A polyamide resin is mixed with 1W50wt% silica, particle size 0.01W50μ, specific area 100W900m2/g, selected from the group consisting of dry process silica fine powder and wet process silica fine powder, and this silica- containing polyamide resin composition is molded into a sheet or a fiber-form molding. Then, this molding is immersed in a 1W5wt% nonionic surfactant solution and degreased at 40W70°C and, after chemical ethcing, sensitization and activation, the molding is subjected to electroless treatment.
EFFECT: The molding thus produced has a surface which is microscopically rough markedly and has a large surface area and therefore, a surface-roughening step, which is usually carried, can be omitted.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4250681A JPS57158236A (en) | 1981-03-25 | 1981-03-25 | Production of electroless-plated polyamide resin molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4250681A JPS57158236A (en) | 1981-03-25 | 1981-03-25 | Production of electroless-plated polyamide resin molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57158236A true JPS57158236A (en) | 1982-09-30 |
Family
ID=12637945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4250681A Pending JPS57158236A (en) | 1981-03-25 | 1981-03-25 | Production of electroless-plated polyamide resin molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57158236A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5845258A (en) * | 1981-09-10 | 1983-03-16 | Mitsubishi Rayon Co Ltd | Polyamide resin composition for metal plating |
| US5279899A (en) * | 1992-03-17 | 1994-01-18 | Monsanto Company | Sulfonated polyamides |
| JP2008208389A (en) * | 2007-02-23 | 2008-09-11 | Kaneka Corp | Material for electroless plating, laminate and printed wiring board |
-
1981
- 1981-03-25 JP JP4250681A patent/JPS57158236A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5845258A (en) * | 1981-09-10 | 1983-03-16 | Mitsubishi Rayon Co Ltd | Polyamide resin composition for metal plating |
| US5279899A (en) * | 1992-03-17 | 1994-01-18 | Monsanto Company | Sulfonated polyamides |
| JP2008208389A (en) * | 2007-02-23 | 2008-09-11 | Kaneka Corp | Material for electroless plating, laminate and printed wiring board |
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