JPS57157596A - Method of producing thin film circuit board - Google Patents
Method of producing thin film circuit boardInfo
- Publication number
- JPS57157596A JPS57157596A JP4296081A JP4296081A JPS57157596A JP S57157596 A JPS57157596 A JP S57157596A JP 4296081 A JP4296081 A JP 4296081A JP 4296081 A JP4296081 A JP 4296081A JP S57157596 A JPS57157596 A JP S57157596A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- thin film
- film circuit
- producing thin
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4296081A JPS57157596A (en) | 1981-03-24 | 1981-03-24 | Method of producing thin film circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4296081A JPS57157596A (en) | 1981-03-24 | 1981-03-24 | Method of producing thin film circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57157596A true JPS57157596A (en) | 1982-09-29 |
Family
ID=12650590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4296081A Pending JPS57157596A (en) | 1981-03-24 | 1981-03-24 | Method of producing thin film circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57157596A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8800460B2 (en) | 2009-04-15 | 2014-08-12 | Nippon Yusen Kabushiki Kaisha | Ship |
CN112828516A (en) * | 2020-12-31 | 2021-05-25 | 三芯威电子科技(江苏)有限公司 | Back plate through hole gold needle welding device and technological method for communication base station |
-
1981
- 1981-03-24 JP JP4296081A patent/JPS57157596A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8800460B2 (en) | 2009-04-15 | 2014-08-12 | Nippon Yusen Kabushiki Kaisha | Ship |
CN112828516A (en) * | 2020-12-31 | 2021-05-25 | 三芯威电子科技(江苏)有限公司 | Back plate through hole gold needle welding device and technological method for communication base station |
CN112828516B (en) * | 2020-12-31 | 2022-07-08 | 三芯威电子科技(江苏)有限公司 | Back plate through hole gold needle welding device and process method for communication base station |
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