JPS57157596A - Method of producing thin film circuit board - Google Patents

Method of producing thin film circuit board

Info

Publication number
JPS57157596A
JPS57157596A JP4296081A JP4296081A JPS57157596A JP S57157596 A JPS57157596 A JP S57157596A JP 4296081 A JP4296081 A JP 4296081A JP 4296081 A JP4296081 A JP 4296081A JP S57157596 A JPS57157596 A JP S57157596A
Authority
JP
Japan
Prior art keywords
circuit board
thin film
film circuit
producing thin
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4296081A
Other languages
Japanese (ja)
Inventor
Takaharu Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP4296081A priority Critical patent/JPS57157596A/en
Publication of JPS57157596A publication Critical patent/JPS57157596A/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP4296081A 1981-03-24 1981-03-24 Method of producing thin film circuit board Pending JPS57157596A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4296081A JPS57157596A (en) 1981-03-24 1981-03-24 Method of producing thin film circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4296081A JPS57157596A (en) 1981-03-24 1981-03-24 Method of producing thin film circuit board

Publications (1)

Publication Number Publication Date
JPS57157596A true JPS57157596A (en) 1982-09-29

Family

ID=12650590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4296081A Pending JPS57157596A (en) 1981-03-24 1981-03-24 Method of producing thin film circuit board

Country Status (1)

Country Link
JP (1) JPS57157596A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8800460B2 (en) 2009-04-15 2014-08-12 Nippon Yusen Kabushiki Kaisha Ship
CN112828516A (en) * 2020-12-31 2021-05-25 三芯威电子科技(江苏)有限公司 Back plate through hole gold needle welding device and technological method for communication base station

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8800460B2 (en) 2009-04-15 2014-08-12 Nippon Yusen Kabushiki Kaisha Ship
CN112828516A (en) * 2020-12-31 2021-05-25 三芯威电子科技(江苏)有限公司 Back plate through hole gold needle welding device and technological method for communication base station
CN112828516B (en) * 2020-12-31 2022-07-08 三芯威电子科技(江苏)有限公司 Back plate through hole gold needle welding device and process method for communication base station

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