JPS57153436A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57153436A JPS57153436A JP56038508A JP3850881A JPS57153436A JP S57153436 A JPS57153436 A JP S57153436A JP 56038508 A JP56038508 A JP 56038508A JP 3850881 A JP3850881 A JP 3850881A JP S57153436 A JPS57153436 A JP S57153436A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- passivation film
- film
- electrode
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
Abstract
PURPOSE:To obtain a stable protective film, which is easily treated, by forming a passivation film by amorphous Si;H containing a large number of bonds of Si and H2 when the passivation film is shaped onto an Al electrode exposed on the surface of the semiconductor device and an insulating film surrounding the electrode. CONSTITUTION:Semiconductor substrates 5 pasted on anode and cathode electrodes 4 are opposed at an interval in a plasma CVD device 1, SiH4 gas is fed in from an inflow port 3 while the inside of the device 1 is evacuated by using an exhaust port 2, and gas pressure is brought to 0.05-5Torr. The high-frequency voltage of several dozen W is applied between the electrodes 4 to generate glow discharge, and the passivation film consisting of Si;H is deposited onto the Al electrodes exposed on the surfaces of the substrates 5 and the insulating films surrounding the Al electrodes. Accordingly, the temperature of the substrate may be the normal temperature of 300 deg.C or lower, and the stable protective film can easily be obtained without exerting a bad influence on the electrical characteristics of an element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56038508A JPS57153436A (en) | 1981-03-17 | 1981-03-17 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56038508A JPS57153436A (en) | 1981-03-17 | 1981-03-17 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57153436A true JPS57153436A (en) | 1982-09-22 |
Family
ID=12527204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56038508A Pending JPS57153436A (en) | 1981-03-17 | 1981-03-17 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57153436A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59151432A (en) * | 1983-02-18 | 1984-08-29 | Toshiba Corp | Semiconductor device |
JPS6066422A (en) * | 1983-09-21 | 1985-04-16 | Kanegafuchi Chem Ind Co Ltd | Manufacture of semiconductor |
JPS63128726U (en) * | 1987-02-16 | 1988-08-23 |
-
1981
- 1981-03-17 JP JP56038508A patent/JPS57153436A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59151432A (en) * | 1983-02-18 | 1984-08-29 | Toshiba Corp | Semiconductor device |
JPS6066422A (en) * | 1983-09-21 | 1985-04-16 | Kanegafuchi Chem Ind Co Ltd | Manufacture of semiconductor |
JPS63128726U (en) * | 1987-02-16 | 1988-08-23 |
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