JPS57148353A - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPS57148353A JPS57148353A JP56033820A JP3382081A JPS57148353A JP S57148353 A JPS57148353 A JP S57148353A JP 56033820 A JP56033820 A JP 56033820A JP 3382081 A JP3382081 A JP 3382081A JP S57148353 A JPS57148353 A JP S57148353A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- container
- electrode
- anode
- sandwiched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To prevent the anode and cathode of an element from being damaged and to make electronic parts less costly by a method wherein, when a semiconductor rectifier element is sandwiched between the obverse and reverse surface electrodes and contained in a ceramic container, the electrode is prepared with a material composed of sintered iron impregnated with copper. CONSTITUTION:A semiconductor element 2 such as a rectifier element is supported by a supporting plate 9 made of W, Mo and the like, and the supporting plate 9 and the element 2 are sandwiched between electrodes 5 and 6. Subsequently, the assembly is contained in a ceramic container 1 supplied with an airtight space 8 and the electrode 5 is fixed to one end of the container 1 via a metal ring 3 using silver solder 10 and 11. In addition, the electrode 6 is also fixed to the other end of the container 1 via a metal ring 4 and an auxiliary ring 7 using silver solder 12 and 13. With this construction, a material composed of sintered iron impregnated with copper is used instead of expensive non-oxigen copper, deoxidized copper. In so doing, the element 2 is not likely to damage the anode and cathode and excellent airtightness can be maintained inexpensively.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56033820A JPS57148353A (en) | 1981-03-11 | 1981-03-11 | Electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56033820A JPS57148353A (en) | 1981-03-11 | 1981-03-11 | Electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57148353A true JPS57148353A (en) | 1982-09-13 |
Family
ID=12397115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56033820A Pending JPS57148353A (en) | 1981-03-11 | 1981-03-11 | Electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57148353A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999035687A1 (en) * | 1998-01-09 | 1999-07-15 | Asea Brown Boveri Ag | Low-inductance, gate-controlled thyristor |
-
1981
- 1981-03-11 JP JP56033820A patent/JPS57148353A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999035687A1 (en) * | 1998-01-09 | 1999-07-15 | Asea Brown Boveri Ag | Low-inductance, gate-controlled thyristor |
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