JPS57148353A - Electronic parts - Google Patents

Electronic parts

Info

Publication number
JPS57148353A
JPS57148353A JP56033820A JP3382081A JPS57148353A JP S57148353 A JPS57148353 A JP S57148353A JP 56033820 A JP56033820 A JP 56033820A JP 3382081 A JP3382081 A JP 3382081A JP S57148353 A JPS57148353 A JP S57148353A
Authority
JP
Japan
Prior art keywords
copper
container
electrode
anode
sandwiched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56033820A
Other languages
Japanese (ja)
Inventor
Yutaka Sato
Hiroshi Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56033820A priority Critical patent/JPS57148353A/en
Publication of JPS57148353A publication Critical patent/JPS57148353A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent the anode and cathode of an element from being damaged and to make electronic parts less costly by a method wherein, when a semiconductor rectifier element is sandwiched between the obverse and reverse surface electrodes and contained in a ceramic container, the electrode is prepared with a material composed of sintered iron impregnated with copper. CONSTITUTION:A semiconductor element 2 such as a rectifier element is supported by a supporting plate 9 made of W, Mo and the like, and the supporting plate 9 and the element 2 are sandwiched between electrodes 5 and 6. Subsequently, the assembly is contained in a ceramic container 1 supplied with an airtight space 8 and the electrode 5 is fixed to one end of the container 1 via a metal ring 3 using silver solder 10 and 11. In addition, the electrode 6 is also fixed to the other end of the container 1 via a metal ring 4 and an auxiliary ring 7 using silver solder 12 and 13. With this construction, a material composed of sintered iron impregnated with copper is used instead of expensive non-oxigen copper, deoxidized copper. In so doing, the element 2 is not likely to damage the anode and cathode and excellent airtightness can be maintained inexpensively.
JP56033820A 1981-03-11 1981-03-11 Electronic parts Pending JPS57148353A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56033820A JPS57148353A (en) 1981-03-11 1981-03-11 Electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56033820A JPS57148353A (en) 1981-03-11 1981-03-11 Electronic parts

Publications (1)

Publication Number Publication Date
JPS57148353A true JPS57148353A (en) 1982-09-13

Family

ID=12397115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56033820A Pending JPS57148353A (en) 1981-03-11 1981-03-11 Electronic parts

Country Status (1)

Country Link
JP (1) JPS57148353A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999035687A1 (en) * 1998-01-09 1999-07-15 Asea Brown Boveri Ag Low-inductance, gate-controlled thyristor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999035687A1 (en) * 1998-01-09 1999-07-15 Asea Brown Boveri Ag Low-inductance, gate-controlled thyristor

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