JPS57132968A - Grinding sheet-like article - Google Patents

Grinding sheet-like article

Info

Publication number
JPS57132968A
JPS57132968A JP56018093A JP1809381A JPS57132968A JP S57132968 A JPS57132968 A JP S57132968A JP 56018093 A JP56018093 A JP 56018093A JP 1809381 A JP1809381 A JP 1809381A JP S57132968 A JPS57132968 A JP S57132968A
Authority
JP
Japan
Prior art keywords
convex
portions
concave
concave portions
fibrous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56018093A
Other languages
Japanese (ja)
Inventor
Yasuyoshi Horiguchi
Shunichi Shinohara
Shigeki Iwamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP56018093A priority Critical patent/JPS57132968A/en
Publication of JPS57132968A publication Critical patent/JPS57132968A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To provide an evenly finished surface to be ground and prevent said surface from being choked with grain or the like by constituting the irregular structure from fibrous materials and adhesives to be formed with concave portions cut out solvably by solvent and discrete concave and convex fibrous portions. CONSTITUTION:Fibrous density of convex portions 3 is approximately identical to that of concave portions 2 and uniform. Side surfaces 15 of convex portions exist as ends of fibers and the concave portions 2 are cut out solvably by solvent. The surfaces 14, 16 of convex and concave portions are formed with discrete fibers and the ratio of the area of concave portion surface 16 to that of surfaces 14, 16 is 20-80%. The number of individual concave portions 2 or convex ones 3 per unit area is 9-500 pieces/cm.
JP56018093A 1981-02-12 1981-02-12 Grinding sheet-like article Pending JPS57132968A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56018093A JPS57132968A (en) 1981-02-12 1981-02-12 Grinding sheet-like article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56018093A JPS57132968A (en) 1981-02-12 1981-02-12 Grinding sheet-like article

Publications (1)

Publication Number Publication Date
JPS57132968A true JPS57132968A (en) 1982-08-17

Family

ID=11962012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56018093A Pending JPS57132968A (en) 1981-02-12 1981-02-12 Grinding sheet-like article

Country Status (1)

Country Link
JP (1) JPS57132968A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099390A (en) * 1997-10-06 2000-08-08 Matsushita Electronics Corporation Polishing pad for semiconductor wafer and method for polishing semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099390A (en) * 1997-10-06 2000-08-08 Matsushita Electronics Corporation Polishing pad for semiconductor wafer and method for polishing semiconductor wafer

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