JPS5713208U - - Google Patents
Info
- Publication number
- JPS5713208U JPS5713208U JP8986280U JP8986280U JPS5713208U JP S5713208 U JPS5713208 U JP S5713208U JP 8986280 U JP8986280 U JP 8986280U JP 8986280 U JP8986280 U JP 8986280U JP S5713208 U JPS5713208 U JP S5713208U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8986280U JPS5713208U (en) | 1980-06-26 | 1980-06-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8986280U JPS5713208U (en) | 1980-06-26 | 1980-06-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5713208U true JPS5713208U (en) | 1982-01-23 |
Family
ID=29451883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8986280U Pending JPS5713208U (en) | 1980-06-26 | 1980-06-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5713208U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6438201A (en) * | 1987-08-03 | 1989-02-08 | Houmura Sangyo Kk | Disk grinder edge for woodworking |
WO2018146755A1 (en) * | 2017-02-08 | 2018-08-16 | 信越エンジニアリング株式会社 | Resin sealing device and resin sealing method |
-
1980
- 1980-06-26 JP JP8986280U patent/JPS5713208U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6438201A (en) * | 1987-08-03 | 1989-02-08 | Houmura Sangyo Kk | Disk grinder edge for woodworking |
JPH0546283B2 (en) * | 1987-08-03 | 1993-07-13 | Homura Sangyo Kk | |
WO2018146755A1 (en) * | 2017-02-08 | 2018-08-16 | 信越エンジニアリング株式会社 | Resin sealing device and resin sealing method |