JPS571275A - Light emitting element - Google Patents

Light emitting element

Info

Publication number
JPS571275A
JPS571275A JP7509380A JP7509380A JPS571275A JP S571275 A JPS571275 A JP S571275A JP 7509380 A JP7509380 A JP 7509380A JP 7509380 A JP7509380 A JP 7509380A JP S571275 A JPS571275 A JP S571275A
Authority
JP
Japan
Prior art keywords
lead
light emitting
stem
constitution
reflecting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7509380A
Other languages
Japanese (ja)
Inventor
Yoshimasa Oki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7509380A priority Critical patent/JPS571275A/en
Publication of JPS571275A publication Critical patent/JPS571275A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To expand the effective light emitting area and to obtain excellent appearance by providing a concave reflecting surface at the top of one lead of a stem and removing the part facing another lead along the length reaching the bottom. CONSTITUTION:The tip of one lead 64 of the stem is configured as the concave reflecting surface. The part thereof facing the other lead 74 is removed along the length reaching the bottom. The flat end of the lead 74 is located on the same plane as the bottom surface of the lead 64. In this constitution, if a flip chip element having an M-I-N junction structure such as GaN is attached, with a lead 65 as the I side and a lead 75 as the N side, the light emitted from the chip side is reflected and advanced forward. Thus the emitting region looks like as if it is expanded. Even though the long and slender element is used, unnatural apperanace can be corrected.
JP7509380A 1980-06-03 1980-06-03 Light emitting element Pending JPS571275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7509380A JPS571275A (en) 1980-06-03 1980-06-03 Light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7509380A JPS571275A (en) 1980-06-03 1980-06-03 Light emitting element

Publications (1)

Publication Number Publication Date
JPS571275A true JPS571275A (en) 1982-01-06

Family

ID=13566205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7509380A Pending JPS571275A (en) 1980-06-03 1980-06-03 Light emitting element

Country Status (1)

Country Link
JP (1) JPS571275A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181155U (en) * 1984-10-31 1986-05-29
US8502239B2 (en) 2003-05-13 2013-08-06 Bridgelux, Inc. High power allngan based multi-chip light emitting diode

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5546573A (en) * 1978-09-30 1980-04-01 Toshiba Corp Electrode member for light emission device, method of fabricating the same and punch therefor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5546573A (en) * 1978-09-30 1980-04-01 Toshiba Corp Electrode member for light emission device, method of fabricating the same and punch therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181155U (en) * 1984-10-31 1986-05-29
US8502239B2 (en) 2003-05-13 2013-08-06 Bridgelux, Inc. High power allngan based multi-chip light emitting diode

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