JPS5712531B2 - - Google Patents

Info

Publication number
JPS5712531B2
JPS5712531B2 JP13106076A JP13106076A JPS5712531B2 JP S5712531 B2 JPS5712531 B2 JP S5712531B2 JP 13106076 A JP13106076 A JP 13106076A JP 13106076 A JP13106076 A JP 13106076A JP S5712531 B2 JPS5712531 B2 JP S5712531B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13106076A
Other languages
Japanese (ja)
Other versions
JPS5355967A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13106076A priority Critical patent/JPS5355967A/ja
Publication of JPS5355967A publication Critical patent/JPS5355967A/ja
Publication of JPS5712531B2 publication Critical patent/JPS5712531B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP13106076A 1976-10-30 1976-10-30 Method of coneirming position for feeding lead frames Granted JPS5355967A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13106076A JPS5355967A (en) 1976-10-30 1976-10-30 Method of coneirming position for feeding lead frames

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13106076A JPS5355967A (en) 1976-10-30 1976-10-30 Method of coneirming position for feeding lead frames

Publications (2)

Publication Number Publication Date
JPS5355967A JPS5355967A (en) 1978-05-20
JPS5712531B2 true JPS5712531B2 (de) 1982-03-11

Family

ID=15049057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13106076A Granted JPS5355967A (en) 1976-10-30 1976-10-30 Method of coneirming position for feeding lead frames

Country Status (1)

Country Link
JP (1) JPS5355967A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0113961Y2 (de) * 1983-04-28 1989-04-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0113961Y2 (de) * 1983-04-28 1989-04-24

Also Published As

Publication number Publication date
JPS5355967A (en) 1978-05-20

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