JPS5712025A - Production of molding resin - Google Patents
Production of molding resinInfo
- Publication number
- JPS5712025A JPS5712025A JP8514280A JP8514280A JPS5712025A JP S5712025 A JPS5712025 A JP S5712025A JP 8514280 A JP8514280 A JP 8514280A JP 8514280 A JP8514280 A JP 8514280A JP S5712025 A JPS5712025 A JP S5712025A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- mixed
- melt
- inorg
- compsn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To produce a molding resing which gives molded articles having high reliability and output, by a method wherein an epoxy resin and a phenolic resin hardener (one of them being solid and the other being liquid) are melt-mixed, and then an inorg. filler and a curing promotor are melt-mixed with the resulting mixture.
CONSTITUTION: In a process for the production of a molding resin employing an epoxy resin compsn. contg. an epoxy resin having at least two epoxy groups per molecule, a phenolic resin hardener having at least two hydroxyl groups per molecule, a curing promotor and an inorg. filler powder, at least one component selected from the epoxy resin and the phenolic resin hardener is solid and the other is liquid or viscous. A mixture of the epoxy resin and the phenolic resin hardener excluding the curing promotor is previously melt-mixed and then the whole epoxy resin compsn. contg. 55W70vol% (based on the entire volume of the compsn.) said inorg. filler powder, is melt-mixed.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8514280A JPS5712025A (en) | 1980-06-25 | 1980-06-25 | Production of molding resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8514280A JPS5712025A (en) | 1980-06-25 | 1980-06-25 | Production of molding resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5712025A true JPS5712025A (en) | 1982-01-21 |
JPS626572B2 JPS626572B2 (en) | 1987-02-12 |
Family
ID=13850404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8514280A Granted JPS5712025A (en) | 1980-06-25 | 1980-06-25 | Production of molding resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5712025A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58186166U (en) * | 1982-06-04 | 1983-12-10 | ヤンマーディーゼル株式会社 | row type fuel injection pump |
JPS6151949A (en) * | 1984-08-22 | 1986-03-14 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
JPH0669259A (en) * | 1993-06-14 | 1994-03-11 | Nitto Denko Corp | Resin tablet for sealing semiconductor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55165946A (en) * | 1979-06-14 | 1980-12-24 | Hitachi Chem Co Ltd | Production of epoxy resin composition |
-
1980
- 1980-06-25 JP JP8514280A patent/JPS5712025A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55165946A (en) * | 1979-06-14 | 1980-12-24 | Hitachi Chem Co Ltd | Production of epoxy resin composition |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58186166U (en) * | 1982-06-04 | 1983-12-10 | ヤンマーディーゼル株式会社 | row type fuel injection pump |
JPS6151949A (en) * | 1984-08-22 | 1986-03-14 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
JPH0669259A (en) * | 1993-06-14 | 1994-03-11 | Nitto Denko Corp | Resin tablet for sealing semiconductor |
JP2576018B2 (en) * | 1993-06-14 | 1997-01-29 | 日東電工株式会社 | Resin tablet for semiconductor encapsulation |
Also Published As
Publication number | Publication date |
---|---|
JPS626572B2 (en) | 1987-02-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5717153A (en) | Sealing method of electronic parts | |
JPS5227436A (en) | Polyester resin composition for powder coating | |
ES8700297A1 (en) | Chemically curable resins derived from 1-oxa-3-aza-tetralin groups containing compounds and cycloaliphatic epoxy resins, process for their preparation and cure as well as the use of such resins. | |
AU4784672A (en) | Process for producing solid epoxy resin compositions | |
EP0385736A3 (en) | Epoxy encapsulant compositions and low stress additives therefor | |
ES426094A1 (en) | Process for the manufacture of structural elements | |
JPS5712025A (en) | Production of molding resin | |
JPS5388097A (en) | Epoxy resin composition | |
JPS56116742A (en) | Synthetic resin composition | |
JPS53123457A (en) | Molding resin composition | |
JPS56133856A (en) | Epoxy resin composition for sealing semiconductor | |
JPS56135584A (en) | Molded sealing material | |
ES8605843A1 (en) | Mixture for the preparation of acid-resistant sealants and impregnated products, method for their preparation and their use. | |
JPS5235779A (en) | Method of producing macroporous anion-exchange resin | |
JPS5380000A (en) | Process for curing epoxy compound | |
JPS55156341A (en) | Resin composition for realing electronic parts | |
JPS5228538A (en) | Process for preparing thermoplastic resin compositions containing inor ganic fillers | |
JPS5222100A (en) | Photo-setting epoxy resins | |
JPS5226554A (en) | Process for producing powdered molding materials based on thermosettin g resins | |
JPS57187325A (en) | Production of epoxy resin laminated sheet | |
JPS51129500A (en) | Curing agent for epoxy resin | |
GB1360813A (en) | Diglycidyl esters of substituted alkane-omega,omega,-dicarboxylic acids | |
JPS5325698A (en) | Non-crystallizing epoxy resin composition | |
JPS56104926A (en) | Epoxy resin composition for sealing electronic parts | |
JPS5317698A (en) | Preparation of epoxy resin varnishes |