JPS57116775A - Etching solution for nickel - Google Patents
Etching solution for nickelInfo
- Publication number
- JPS57116775A JPS57116775A JP56004321A JP432181A JPS57116775A JP S57116775 A JPS57116775 A JP S57116775A JP 56004321 A JP56004321 A JP 56004321A JP 432181 A JP432181 A JP 432181A JP S57116775 A JPS57116775 A JP S57116775A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- soln
- nickel
- nh4cl
- capacity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56004321A JPS57116775A (en) | 1981-01-14 | 1981-01-14 | Etching solution for nickel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56004321A JPS57116775A (en) | 1981-01-14 | 1981-01-14 | Etching solution for nickel |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57116775A true JPS57116775A (en) | 1982-07-20 |
JPS6343470B2 JPS6343470B2 (ja) | 1988-08-30 |
Family
ID=11581191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56004321A Granted JPS57116775A (en) | 1981-01-14 | 1981-01-14 | Etching solution for nickel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57116775A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0887439A1 (en) * | 1997-06-12 | 1998-12-30 | Macdermid Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
US6146701A (en) * | 1997-06-12 | 2000-11-14 | Macdermid, Incorporated | Process for improving the adhension of polymeric materials to metal surfaces |
US6162503A (en) * | 1997-06-12 | 2000-12-19 | Macdermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
US6383272B1 (en) | 2000-06-08 | 2002-05-07 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
US6419784B1 (en) | 2000-06-21 | 2002-07-16 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
US6554948B1 (en) | 2000-08-22 | 2003-04-29 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
EP2021519A4 (en) * | 2006-05-03 | 2016-11-09 | Omg Electronic Chemicals Inc | PROCESS AND COMPOSITION FOR SELECTIVE CUTTING OF NICKEL FROM SUBSTRATE |
CN113265660A (zh) * | 2021-04-30 | 2021-08-17 | 光华科学技术研究院(广东)有限公司 | 蚀刻液及其应用 |
-
1981
- 1981-01-14 JP JP56004321A patent/JPS57116775A/ja active Granted
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0887439A1 (en) * | 1997-06-12 | 1998-12-30 | Macdermid Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
US6146701A (en) * | 1997-06-12 | 2000-11-14 | Macdermid, Incorporated | Process for improving the adhension of polymeric materials to metal surfaces |
US6162503A (en) * | 1997-06-12 | 2000-12-19 | Macdermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
US6383272B1 (en) | 2000-06-08 | 2002-05-07 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
US6503566B2 (en) | 2000-06-08 | 2003-01-07 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
US6419784B1 (en) | 2000-06-21 | 2002-07-16 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
US6554948B1 (en) | 2000-08-22 | 2003-04-29 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
EP2021519A4 (en) * | 2006-05-03 | 2016-11-09 | Omg Electronic Chemicals Inc | PROCESS AND COMPOSITION FOR SELECTIVE CUTTING OF NICKEL FROM SUBSTRATE |
CN113265660A (zh) * | 2021-04-30 | 2021-08-17 | 光华科学技术研究院(广东)有限公司 | 蚀刻液及其应用 |
Also Published As
Publication number | Publication date |
---|---|
JPS6343470B2 (ja) | 1988-08-30 |
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