JPS57106194A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS57106194A JPS57106194A JP18352580A JP18352580A JPS57106194A JP S57106194 A JPS57106194 A JP S57106194A JP 18352580 A JP18352580 A JP 18352580A JP 18352580 A JP18352580 A JP 18352580A JP S57106194 A JPS57106194 A JP S57106194A
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- printed
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18352580A JPS57106194A (en) | 1980-12-24 | 1980-12-24 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18352580A JPS57106194A (en) | 1980-12-24 | 1980-12-24 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57106194A true JPS57106194A (en) | 1982-07-01 |
Family
ID=16137359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18352580A Pending JPS57106194A (en) | 1980-12-24 | 1980-12-24 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57106194A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102480835A (en) * | 2010-11-24 | 2012-05-30 | 三星电机株式会社 | Soldering connecting pin, semiconductor package substrate and method of mounting semiconductor chip using the same |
CN109309291A (en) * | 2017-07-26 | 2019-02-05 | 朗德万斯公司 | The connection of conducting element and illuminating device circuit board |
-
1980
- 1980-12-24 JP JP18352580A patent/JPS57106194A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102480835A (en) * | 2010-11-24 | 2012-05-30 | 三星电机株式会社 | Soldering connecting pin, semiconductor package substrate and method of mounting semiconductor chip using the same |
KR20120056128A (en) * | 2010-11-24 | 2012-06-01 | 삼성전기주식회사 | Soldering connecting pin, semiconductor package substrate and method of mounting a semiconductor chip using the same |
JP2012114394A (en) * | 2010-11-24 | 2012-06-14 | Samsung Electro-Mechanics Co Ltd | Soldered connection pin, semiconductor package substrate including the same, and mount method for semiconductor chip |
CN109309291A (en) * | 2017-07-26 | 2019-02-05 | 朗德万斯公司 | The connection of conducting element and illuminating device circuit board |
CN109309291B (en) * | 2017-07-26 | 2021-06-01 | 朗德万斯公司 | Connection of conductive element to circuit board of light-emitting device |
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