JPS57104248A - Manufacture of hybrid integrated circuit - Google Patents
Manufacture of hybrid integrated circuitInfo
- Publication number
- JPS57104248A JPS57104248A JP55180930A JP18093080A JPS57104248A JP S57104248 A JPS57104248 A JP S57104248A JP 55180930 A JP55180930 A JP 55180930A JP 18093080 A JP18093080 A JP 18093080A JP S57104248 A JPS57104248 A JP S57104248A
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- spacers
- baked
- substrate
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
PURPOSE:To prevent a warp generated in a substrate in a heating process by a method wherein a large number of the substrates and spacers are fast stuck and pressed and housed in a pressure jig while putting the spacers on one main surfaces of the substrates, the substrates and the spacers are heated together with the pressure jig, and resistance paints are baked. CONSTITUTION:A hybrid integrated circuit substrate is formed by a metal such as aluminum, and an insulating film is shaped through the anode oxidation, etc. of the surface and the surface is coated with the film. Copper foil is pasted onto the surfaces of the substrates and predetermined circuit patterns are formed through etching, and the resistance paints are screen-printed at prescribed positions and baked and resistors are shaped. When baking, however, the spacers 5, which contact with the fringes of the substrates 1 (dotted lines) and have vent slits 6, are contacted with the surfaces of the substrates, and the resistance paints are baked and the substrates are annealed under a condition that the spacers 5 and the substrates 1 are held alternately and pressed. Accordingly, a warp and torsion can be prevented even when the thickness of the substrate 1 is 1mm. or thinner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55180930A JPS5942460B2 (en) | 1980-12-19 | 1980-12-19 | Method for manufacturing hybrid integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55180930A JPS5942460B2 (en) | 1980-12-19 | 1980-12-19 | Method for manufacturing hybrid integrated circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57104248A true JPS57104248A (en) | 1982-06-29 |
| JPS5942460B2 JPS5942460B2 (en) | 1984-10-15 |
Family
ID=16091758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55180930A Expired JPS5942460B2 (en) | 1980-12-19 | 1980-12-19 | Method for manufacturing hybrid integrated circuits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5942460B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5844200A (en) * | 1996-05-16 | 1998-12-01 | Sendex Medical, Inc. | Method for drilling subminiature through holes in a sensor substrate with a laser |
-
1980
- 1980-12-19 JP JP55180930A patent/JPS5942460B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5844200A (en) * | 1996-05-16 | 1998-12-01 | Sendex Medical, Inc. | Method for drilling subminiature through holes in a sensor substrate with a laser |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5942460B2 (en) | 1984-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2711983A (en) | Printed electric circuits and method of application | |
| US4297670A (en) | Metal foil resistor | |
| JPS5986289A (en) | Molded circuit board and method of producing same | |
| US3296574A (en) | Film resistors with multilayer terminals | |
| US3895218A (en) | Electric heater plate and terminal thereof | |
| US5112648A (en) | Method of manufacturing a printed circuit board | |
| US3808680A (en) | Continuous processing for substrate manufacture | |
| JPS57104248A (en) | Manufacture of hybrid integrated circuit | |
| US4016645A (en) | Electric heater plate and terminal thereof | |
| US3324362A (en) | Electrical components formed by thin metallic form on solid substrates | |
| GB874965A (en) | Improvements in or relating to electrical circuits or circuit elements | |
| JPH08255701A (en) | Chip-electronic component | |
| US2823286A (en) | Contacts for electrical circuits and methods for making same | |
| JP3304130B2 (en) | Method of manufacturing rectangular thin film chip resistor | |
| JPS6448492A (en) | Manufacture of flexible printed wiring board | |
| JPS6489389A (en) | Manufacture of flexible printed wiring board | |
| JP3104690B2 (en) | Manufacturing method of square plate type chip resistor | |
| JPH0427180Y2 (en) | ||
| JPS6414992A (en) | Manufacture of printed wiring board | |
| JPS6031116B2 (en) | Electric wiring circuit board and its manufacturing method | |
| JPS6436084A (en) | Thin film photosensor | |
| JPH07297006A (en) | Chip electronic part | |
| SU1004485A1 (en) | Method for making thin-film resistors on flexible support | |
| JPS56133850A (en) | Manufacture of semiconductor device | |
| JPS5632747A (en) | Semiconductor device |