JPS5694738A - Manufacturing method of semiconductor device - Google Patents

Manufacturing method of semiconductor device

Info

Publication number
JPS5694738A
JPS5694738A JP17105979A JP17105979A JPS5694738A JP S5694738 A JPS5694738 A JP S5694738A JP 17105979 A JP17105979 A JP 17105979A JP 17105979 A JP17105979 A JP 17105979A JP S5694738 A JPS5694738 A JP S5694738A
Authority
JP
Japan
Prior art keywords
reflection
layer
protective film
exposure light
accuracy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17105979A
Other languages
Japanese (ja)
Inventor
Nobuki Kawamura
Hiroshi Tokunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17105979A priority Critical patent/JPS5694738A/en
Publication of JPS5694738A publication Critical patent/JPS5694738A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To improve an accuracy of a resist pattern and an accuracy of a metallic wiring by a method wherein a reflection protective film such as chrome oxide, etc. is coated on a metallic layer to protect an reflection of an exposure light. CONSTITUTION:An aliminium layer 3 is formed on a silicon substrate 1 through an SiO2 layer 2. A reflection protective film 10 composed of chrome oxide is arranged on the surface of the aluminium layer 3 and covering the reflection protective film 10, a photoresist layer 4 is formed. Because of the existence of the reflection protective film 10, an exposure light irradiated through a photomask 6 does not generate a reflection and turbulent reflection after it passes through the photoresist layer 4. Since an obscurity of an exposure pattern due to the reflection. turbulent reflection of the exposure light is not generated, the aluminium layer 3 can be etched with an extremely high accuracy.
JP17105979A 1979-12-28 1979-12-28 Manufacturing method of semiconductor device Pending JPS5694738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17105979A JPS5694738A (en) 1979-12-28 1979-12-28 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17105979A JPS5694738A (en) 1979-12-28 1979-12-28 Manufacturing method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5694738A true JPS5694738A (en) 1981-07-31

Family

ID=15916297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17105979A Pending JPS5694738A (en) 1979-12-28 1979-12-28 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5694738A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933827A (en) * 1982-08-19 1984-02-23 Toshiba Corp Manufacture of semiconductor device
JPS6057622A (en) * 1983-09-07 1985-04-03 Mitsubishi Electric Corp Formation of wiring pattern
JPH01125937A (en) * 1986-11-26 1989-05-18 Meir I Janai Manufacture of integrated circuit
JPH02168626A (en) * 1988-09-13 1990-06-28 Mitsubishi Electric Corp Semiconductor device and its manufacture

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498182A (en) * 1972-05-10 1974-01-24
JPS5158072A (en) * 1974-11-18 1976-05-21 Matsushita Electric Ind Co Ltd HANDOTAISOCHINOSEIZOHOHO
JPS5346700A (en) * 1976-10-12 1978-04-26 Fujitsu Ltd Exposuring method for resist

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498182A (en) * 1972-05-10 1974-01-24
JPS5158072A (en) * 1974-11-18 1976-05-21 Matsushita Electric Ind Co Ltd HANDOTAISOCHINOSEIZOHOHO
JPS5346700A (en) * 1976-10-12 1978-04-26 Fujitsu Ltd Exposuring method for resist

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933827A (en) * 1982-08-19 1984-02-23 Toshiba Corp Manufacture of semiconductor device
JPS6057622A (en) * 1983-09-07 1985-04-03 Mitsubishi Electric Corp Formation of wiring pattern
JPH01125937A (en) * 1986-11-26 1989-05-18 Meir I Janai Manufacture of integrated circuit
JPH02168626A (en) * 1988-09-13 1990-06-28 Mitsubishi Electric Corp Semiconductor device and its manufacture

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