JPS5690254A - Preparation of heater-incorporating substrate for gas sensor - Google Patents
Preparation of heater-incorporating substrate for gas sensorInfo
- Publication number
- JPS5690254A JPS5690254A JP16756179A JP16756179A JPS5690254A JP S5690254 A JPS5690254 A JP S5690254A JP 16756179 A JP16756179 A JP 16756179A JP 16756179 A JP16756179 A JP 16756179A JP S5690254 A JPS5690254 A JP S5690254A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- lead wires
- heater layer
- heater
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Measuring Oxygen Concentration In Cells (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
PURPOSE: To prevent disconnection of a heater layer after burning and eliminate scattering of resistance value by forming the heater layer on one of two unburnt substrate material and by laminating the other substrate material with piercing holes in the positions corresponding to the terminal parts of material lead wires after connecting the lead wires with the heater layer.
CONSTITUTION: The heater layer 13 is formed on the ceramic raw sheet substrate 11a by using platinum paste or the like and the lead wires 14a, 14b and 14c are connected with the terminal part 13a and 13c of the layer. Next, the other substrate 11b is provided with piercing holes 12a, 12b and 12c corresponding to the terminal parts of the lead wires and then is laminated on the layer 13, with positioning being made correctly so that the tips of the lead wires 14a and 14c are positioned nearly at the centers of the terminal parts 13a and 13b. In this way, the tips 12d, 12e and 12f are positioned within the piercing holes 12a-12c of the substrate 11b. Then, electroconductive material is put into the piercing holes to ensure the connection. Thus, the disconnection and the like of the heater layer 13 is prevented and the yield of the substrate 11 is improved.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16756179A JPS5690254A (en) | 1979-12-25 | 1979-12-25 | Preparation of heater-incorporating substrate for gas sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16756179A JPS5690254A (en) | 1979-12-25 | 1979-12-25 | Preparation of heater-incorporating substrate for gas sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5690254A true JPS5690254A (en) | 1981-07-22 |
| JPS6239701B2 JPS6239701B2 (en) | 1987-08-25 |
Family
ID=15852002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16756179A Granted JPS5690254A (en) | 1979-12-25 | 1979-12-25 | Preparation of heater-incorporating substrate for gas sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5690254A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6126162U (en) * | 1984-07-20 | 1986-02-17 | マルコン電子株式会社 | humidity sensor |
| JP2007515636A (en) * | 2003-12-18 | 2007-06-14 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Ceramic laminated composite |
-
1979
- 1979-12-25 JP JP16756179A patent/JPS5690254A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6126162U (en) * | 1984-07-20 | 1986-02-17 | マルコン電子株式会社 | humidity sensor |
| JP2007515636A (en) * | 2003-12-18 | 2007-06-14 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Ceramic laminated composite |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6239701B2 (en) | 1987-08-25 |
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