JPS5685844A - Diode composite circuit device - Google Patents
Diode composite circuit deviceInfo
- Publication number
- JPS5685844A JPS5685844A JP16153179A JP16153179A JPS5685844A JP S5685844 A JPS5685844 A JP S5685844A JP 16153179 A JP16153179 A JP 16153179A JP 16153179 A JP16153179 A JP 16153179A JP S5685844 A JPS5685844 A JP S5685844A
- Authority
- JP
- Japan
- Prior art keywords
- wires
- diodes
- mounting
- lead wires
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
PURPOSE:To shorten the assembling time of a diode composite circuit device by mounting diodes on a printed board on which desired wires are provided on the lower surface thereof with adhesive and solder. CONSTITUTION:Wires 3 are formed on a printed board 1, four lead wires of diodes 4 at one side are shortcircuited at adjacent two wires, and four lead wires of the diodes at the other side are shortcircuited at every other wires. The lead wires 5 of the diodes 4 having coincident characteristics are inserted into four sets of mounting holes 2 confronting each other, and are soldered at 6 on the lower surface. Thus, a rectifying bridge can be obtained. The ends of the center lead wires 5 are cut in short length for an easy direct mounting of the device on the printed board. With this configuration the assembling and mounting periods of the device can be shortened.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16153179A JPS5685844A (en) | 1979-12-14 | 1979-12-14 | Diode composite circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16153179A JPS5685844A (en) | 1979-12-14 | 1979-12-14 | Diode composite circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5685844A true JPS5685844A (en) | 1981-07-13 |
Family
ID=15736853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16153179A Pending JPS5685844A (en) | 1979-12-14 | 1979-12-14 | Diode composite circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5685844A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06219219A (en) * | 1992-11-05 | 1994-08-09 | Artur Fischer Gmbh | Container for use for noise carrier |
US7352583B2 (en) | 2005-10-03 | 2008-04-01 | Remy Technologies, L.L.C. | Flexible lead for a pressfit diode bridge |
-
1979
- 1979-12-14 JP JP16153179A patent/JPS5685844A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06219219A (en) * | 1992-11-05 | 1994-08-09 | Artur Fischer Gmbh | Container for use for noise carrier |
US7352583B2 (en) | 2005-10-03 | 2008-04-01 | Remy Technologies, L.L.C. | Flexible lead for a pressfit diode bridge |
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