JPS5676465A - Low-temperature curable paint composition and preparation of same - Google Patents
Low-temperature curable paint composition and preparation of sameInfo
- Publication number
- JPS5676465A JPS5676465A JP15204679A JP15204679A JPS5676465A JP S5676465 A JPS5676465 A JP S5676465A JP 15204679 A JP15204679 A JP 15204679A JP 15204679 A JP15204679 A JP 15204679A JP S5676465 A JPS5676465 A JP S5676465A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- component
- paint composition
- preparation
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Abstract
PURPOSE: Titled paint composition, comprising an epoxy resin, an epoxy acrylate and an epoxy-modified polyamine in a specified proportion.
CONSTITUTION: (A) 100pts.wt. of an epoxy resin of epoxy equivalent of 100W 1,500, having at least two epoxy groups in one molecule [e.g., a condensate of 2,2'- bis(4,4'-hydroxyphenyl)propane with epichlorohydrin), (B) 10W1,000pts.wt. of an epoxy acrylate obtained by the reaction of the epoxy resin (A) with acrylic acid, and (C) a modified polyamine obtained by the reaction of the component (A) and/or the component (B) with a polyamine having at least two primary amino groups (e.g., diethylene triamine), are compounded, in an equivalent ratio of the active hydrogen in said component (C) to the total of an epoxy group and an acryloyl group in said component (A) and (B), of 0.5W2.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15204679A JPS5676465A (en) | 1979-11-26 | 1979-11-26 | Low-temperature curable paint composition and preparation of same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15204679A JPS5676465A (en) | 1979-11-26 | 1979-11-26 | Low-temperature curable paint composition and preparation of same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5676465A true JPS5676465A (en) | 1981-06-24 |
JPS6312105B2 JPS6312105B2 (en) | 1988-03-17 |
Family
ID=15531862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15204679A Granted JPS5676465A (en) | 1979-11-26 | 1979-11-26 | Low-temperature curable paint composition and preparation of same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5676465A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7723445B2 (en) * | 2004-08-06 | 2010-05-25 | Showa Highpolymer Co., Ltd. | Curable resin composition, molded product, and process for producing the same |
JP2015533862A (en) * | 2012-08-23 | 2015-11-26 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co.KGaA | Two-component (2K) bonding adhesive |
JP2017082206A (en) * | 2015-10-28 | 2017-05-18 | 株式会社大林組 | Manufacturing method of curable resin composition, curable resin composition, manufacturing method of curable resin construction material and curable resin construction material |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4995919A (en) * | 1973-01-24 | 1974-09-11 | ||
JPS51101100A (en) * | 1975-03-05 | 1976-09-07 | Toa Gosei Chem Ind | KOKASEIJUSHISOSEIBUTSU |
JPS53132099A (en) * | 1977-04-22 | 1978-11-17 | Asahi Chem Ind Co Ltd | Thermosetting resin composition hardenable at low temperature |
-
1979
- 1979-11-26 JP JP15204679A patent/JPS5676465A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4995919A (en) * | 1973-01-24 | 1974-09-11 | ||
JPS51101100A (en) * | 1975-03-05 | 1976-09-07 | Toa Gosei Chem Ind | KOKASEIJUSHISOSEIBUTSU |
JPS53132099A (en) * | 1977-04-22 | 1978-11-17 | Asahi Chem Ind Co Ltd | Thermosetting resin composition hardenable at low temperature |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7723445B2 (en) * | 2004-08-06 | 2010-05-25 | Showa Highpolymer Co., Ltd. | Curable resin composition, molded product, and process for producing the same |
EP1785440A4 (en) * | 2004-08-06 | 2011-02-16 | Showa Denko Kk | Curable resin composition, shaped article and method for producing same |
JP2015533862A (en) * | 2012-08-23 | 2015-11-26 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co.KGaA | Two-component (2K) bonding adhesive |
JP2017082206A (en) * | 2015-10-28 | 2017-05-18 | 株式会社大林組 | Manufacturing method of curable resin composition, curable resin composition, manufacturing method of curable resin construction material and curable resin construction material |
Also Published As
Publication number | Publication date |
---|---|
JPS6312105B2 (en) | 1988-03-17 |
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