JPS5667946A - Semiconductor system - Google Patents
Semiconductor systemInfo
- Publication number
- JPS5667946A JPS5667946A JP14417479A JP14417479A JPS5667946A JP S5667946 A JPS5667946 A JP S5667946A JP 14417479 A JP14417479 A JP 14417479A JP 14417479 A JP14417479 A JP 14417479A JP S5667946 A JPS5667946 A JP S5667946A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- conductive cap
- sealing
- insulation film
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To prevent a bonding wire and a conductive cap from continuity and to improve reliability by a method wherein an insulation film is formed at a part facing a semiconductor element, of a conductive cap for sealing a semiconductor element. CONSTITUTION:An insulation film such as a glass layer 8 of approximately 50mum is previously applied to a part facing to a semiconductor element, of an inner face of a conductive cap 7 of a case such as a ceramic case 1 which is for sealing a semiconductor element 2 in it. By performing in this way, even when a mechanical warp or a thermal warp is applied, it can be designed that the conductive cap 7 and a bonding wire 6 are not directly connected, thus, enabling to improve reliability.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14417479A JPS5667946A (en) | 1979-11-07 | 1979-11-07 | Semiconductor system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14417479A JPS5667946A (en) | 1979-11-07 | 1979-11-07 | Semiconductor system |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5667946A true JPS5667946A (en) | 1981-06-08 |
Family
ID=15355920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14417479A Pending JPS5667946A (en) | 1979-11-07 | 1979-11-07 | Semiconductor system |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5667946A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04109541U (en) * | 1991-03-08 | 1992-09-22 | 京セラ株式会社 | Package cage for storing semiconductor elements |
JPH07312396A (en) * | 1994-05-18 | 1995-11-28 | Sumitomo Metal Mining Co Ltd | Semiconductor device and seal cover used for it |
-
1979
- 1979-11-07 JP JP14417479A patent/JPS5667946A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04109541U (en) * | 1991-03-08 | 1992-09-22 | 京セラ株式会社 | Package cage for storing semiconductor elements |
JPH07312396A (en) * | 1994-05-18 | 1995-11-28 | Sumitomo Metal Mining Co Ltd | Semiconductor device and seal cover used for it |
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