JPS5667946A - Semiconductor system - Google Patents

Semiconductor system

Info

Publication number
JPS5667946A
JPS5667946A JP14417479A JP14417479A JPS5667946A JP S5667946 A JPS5667946 A JP S5667946A JP 14417479 A JP14417479 A JP 14417479A JP 14417479 A JP14417479 A JP 14417479A JP S5667946 A JPS5667946 A JP S5667946A
Authority
JP
Japan
Prior art keywords
semiconductor element
conductive cap
sealing
insulation film
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14417479A
Other languages
Japanese (ja)
Inventor
Tsuneaki Isozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14417479A priority Critical patent/JPS5667946A/en
Publication of JPS5667946A publication Critical patent/JPS5667946A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent a bonding wire and a conductive cap from continuity and to improve reliability by a method wherein an insulation film is formed at a part facing a semiconductor element, of a conductive cap for sealing a semiconductor element. CONSTITUTION:An insulation film such as a glass layer 8 of approximately 50mum is previously applied to a part facing to a semiconductor element, of an inner face of a conductive cap 7 of a case such as a ceramic case 1 which is for sealing a semiconductor element 2 in it. By performing in this way, even when a mechanical warp or a thermal warp is applied, it can be designed that the conductive cap 7 and a bonding wire 6 are not directly connected, thus, enabling to improve reliability.
JP14417479A 1979-11-07 1979-11-07 Semiconductor system Pending JPS5667946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14417479A JPS5667946A (en) 1979-11-07 1979-11-07 Semiconductor system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14417479A JPS5667946A (en) 1979-11-07 1979-11-07 Semiconductor system

Publications (1)

Publication Number Publication Date
JPS5667946A true JPS5667946A (en) 1981-06-08

Family

ID=15355920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14417479A Pending JPS5667946A (en) 1979-11-07 1979-11-07 Semiconductor system

Country Status (1)

Country Link
JP (1) JPS5667946A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04109541U (en) * 1991-03-08 1992-09-22 京セラ株式会社 Package cage for storing semiconductor elements
JPH07312396A (en) * 1994-05-18 1995-11-28 Sumitomo Metal Mining Co Ltd Semiconductor device and seal cover used for it

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04109541U (en) * 1991-03-08 1992-09-22 京セラ株式会社 Package cage for storing semiconductor elements
JPH07312396A (en) * 1994-05-18 1995-11-28 Sumitomo Metal Mining Co Ltd Semiconductor device and seal cover used for it

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