JPS5658233A - Positioning device - Google Patents

Positioning device

Info

Publication number
JPS5658233A
JPS5658233A JP13350579A JP13350579A JPS5658233A JP S5658233 A JPS5658233 A JP S5658233A JP 13350579 A JP13350579 A JP 13350579A JP 13350579 A JP13350579 A JP 13350579A JP S5658233 A JPS5658233 A JP S5658233A
Authority
JP
Japan
Prior art keywords
board
wafer
holder
load
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13350579A
Other languages
Japanese (ja)
Inventor
Shoji Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13350579A priority Critical patent/JPS5658233A/en
Publication of JPS5658233A publication Critical patent/JPS5658233A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electron Beam Exposure (AREA)

Abstract

PURPOSE:To prevent the breakage of a wafer in a wafer holding and positioning device and the like to be used for an electron beam exposing device by a method wherein a thin wafer is set at a reference position by one-action movement and the load to be applied then is always maintained at a static load. CONSTITUTION:A wafer 2 is set on a holder 1 and they are attached to a moving board 3. When the moving board 3 is inserted to the main body, the holder 1 is lifted up by a plate spring 4 which moves along the gradient of a block 5 attached to the main body 7 and a wafer 2 is pushed to a substrate 6. At this time, the holder 1 is stopped at a prescribed position by a groove provided on the substrate 6, the moving board 3 moves further and makes the plate spring working. With the above constitution, the load applied to the wafer 2 becomes a static load at all times. After inserting the moving board 3, the energy working direction of the plate spring 4 and the block 5 becomes to be the moving direction of the board 3, and the board 3 is fixed to the main body 7 by a spring 8. By pulling out the board, the load being applied by the spring 4 is removed, making the holder 1 fall upon the board 3. Through such a manner, a series of procedures can be performed only by one-action operation.
JP13350579A 1979-10-18 1979-10-18 Positioning device Pending JPS5658233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13350579A JPS5658233A (en) 1979-10-18 1979-10-18 Positioning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13350579A JPS5658233A (en) 1979-10-18 1979-10-18 Positioning device

Publications (1)

Publication Number Publication Date
JPS5658233A true JPS5658233A (en) 1981-05-21

Family

ID=15106330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13350579A Pending JPS5658233A (en) 1979-10-18 1979-10-18 Positioning device

Country Status (1)

Country Link
JP (1) JPS5658233A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE34953E (en) * 1989-08-31 1995-05-30 Union Oil Company Of California Takeout jaw insert and assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE34953E (en) * 1989-08-31 1995-05-30 Union Oil Company Of California Takeout jaw insert and assembly

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