JPS5656646A - Probing head - Google Patents

Probing head

Info

Publication number
JPS5656646A
JPS5656646A JP13187879A JP13187879A JPS5656646A JP S5656646 A JPS5656646 A JP S5656646A JP 13187879 A JP13187879 A JP 13187879A JP 13187879 A JP13187879 A JP 13187879A JP S5656646 A JPS5656646 A JP S5656646A
Authority
JP
Japan
Prior art keywords
probe
head
contact
bump
leaf spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13187879A
Other languages
Japanese (ja)
Inventor
Masaya Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13187879A priority Critical patent/JPS5656646A/en
Publication of JPS5656646A publication Critical patent/JPS5656646A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To secure a contact despite precision being somewhat low for probe positioning and thus to improve working efficiency by forming a probe with leaf spring. CONSTITUTION:The probe 6 is formed with a slender leaf spring with its one end 6a fixed on a head 7 and tip 6b bent in U shape. When the head is moved in the direction indicated by arrow, the probe 6 deforms according to its elasticity to get over a bump 5 and comes in contact with the bump 5 to measurement. Upon finishing measurement for one row, the head 7 is elevated to probe another row. Since the head 7 need not be moved vertically at each contact, working efficiency can be improved.
JP13187879A 1979-10-15 1979-10-15 Probing head Pending JPS5656646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13187879A JPS5656646A (en) 1979-10-15 1979-10-15 Probing head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13187879A JPS5656646A (en) 1979-10-15 1979-10-15 Probing head

Publications (1)

Publication Number Publication Date
JPS5656646A true JPS5656646A (en) 1981-05-18

Family

ID=15068246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13187879A Pending JPS5656646A (en) 1979-10-15 1979-10-15 Probing head

Country Status (1)

Country Link
JP (1) JPS5656646A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63206671A (en) * 1987-02-24 1988-08-25 Tokyo Electron Ltd Inspection apparatus
JPH01171367U (en) * 1988-05-24 1989-12-05
US7868635B2 (en) 2006-02-20 2011-01-11 Fujitsu Limited Probe

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63206671A (en) * 1987-02-24 1988-08-25 Tokyo Electron Ltd Inspection apparatus
JPH01171367U (en) * 1988-05-24 1989-12-05
US7868635B2 (en) 2006-02-20 2011-01-11 Fujitsu Limited Probe

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