JPS5652995B2 - - Google Patents

Info

Publication number
JPS5652995B2
JPS5652995B2 JP6070977A JP6070977A JPS5652995B2 JP S5652995 B2 JPS5652995 B2 JP S5652995B2 JP 6070977 A JP6070977 A JP 6070977A JP 6070977 A JP6070977 A JP 6070977A JP S5652995 B2 JPS5652995 B2 JP S5652995B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6070977A
Other languages
Japanese (ja)
Other versions
JPS53144836A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6070977A priority Critical patent/JPS53144836A/ja
Publication of JPS53144836A publication Critical patent/JPS53144836A/ja
Publication of JPS5652995B2 publication Critical patent/JPS5652995B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP6070977A 1977-05-25 1977-05-25 Electroless copper plating bath Granted JPS53144836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6070977A JPS53144836A (en) 1977-05-25 1977-05-25 Electroless copper plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6070977A JPS53144836A (en) 1977-05-25 1977-05-25 Electroless copper plating bath

Publications (2)

Publication Number Publication Date
JPS53144836A JPS53144836A (en) 1978-12-16
JPS5652995B2 true JPS5652995B2 (zh) 1981-12-16

Family

ID=13150076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6070977A Granted JPS53144836A (en) 1977-05-25 1977-05-25 Electroless copper plating bath

Country Status (1)

Country Link
JP (1) JPS53144836A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5255015B2 (ja) * 2010-04-28 2013-08-07 名古屋メッキ工業株式会社 高分子繊維の無電解銅めっき方法
EP3255176B1 (en) * 2011-01-11 2019-05-01 MacDermid Enthone America LLC Method of plating particulate matter

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49128A (zh) * 1972-04-21 1974-01-05
JPS5217335A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Chemical copper plating solution

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49128A (zh) * 1972-04-21 1974-01-05
JPS5217335A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Chemical copper plating solution

Also Published As

Publication number Publication date
JPS53144836A (en) 1978-12-16

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