JPS5652446B2 - - Google Patents

Info

Publication number: JPS5652446B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP9920973A

Other languages

Japanese (ja)

Other versions

JPS5050864A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-09-05

Filing date

1973-09-05

Publication date

1981-12-12

1973-09-05 Application filed filed Critical

1973-09-05 Priority to JP9920973A priority Critical patent/JPS5652446B2/ja

1975-05-07 Publication of JPS5050864A publication Critical patent/JPS5050864A/ja

1981-12-12 Publication of JPS5652446B2 publication Critical patent/JPS5652446B2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

JP9920973A 1973-09-05 1973-09-05 Expired JPS5652446B2 (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP9920973A JPS5652446B2 (en)	1973-09-05	1973-09-05

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP9920973A JPS5652446B2 (en)	1973-09-05	1973-09-05

Publications (2)

Publication Number	Publication Date
JPS5050864A JPS5050864A (en)	1975-05-07
JPS5652446B2 true JPS5652446B2 (en)	1981-12-12

Family

ID=14241248

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP9920973A Expired JPS5652446B2 (en)	1973-09-05	1973-09-05

Country Status (1)

Country	Link
JP (1)	JPS5652446B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7329786B2 (en)	2001-09-28	2008-02-12	Great Lakes Chemical Corporation	Processes for producing CF3CFHCF3
US7223351B2 (en)	2003-04-17	2007-05-29	Great Lakes Chemical Corporation	Fire extinguishing mixtures, methods and systems

1973
- 1973-09-05 JP JP9920973A patent/JPS5652446B2/ja not_active Expired

Also Published As

Publication number	Publication date
JPS5050864A (en)	1975-05-07

Publication	Publication Date	Title
AR201758A1 (en)	1975-04-15
AU476761B2 (en)	1976-09-30
AU465372B2 (en)	1975-09-25
AR201235Q (en)	1975-02-21
AR201231Q (en)	1975-02-21
AU474593B2 (en)	1976-07-29
AU474511B2 (en)	1976-07-22
AU474838B2 (en)	1976-08-05
AU465453B2 (en)	1975-09-25
AU465434B2 (en)	1975-09-25
AU471343B2 (en)	1976-04-15
AU450229B2 (en)	1974-07-04
AU476714B2 (en)	1976-09-30
AR201229Q (en)	1975-02-21
AU476696B2 (en)	1976-09-30
AU466283B2 (en)	1975-10-23
AU472848B2 (en)	1976-06-03
AR199451A1 (en)	1974-08-30
AU477823B2 (en)	1975-06-19
AU471461B2 (en)	1976-04-29
AR200256A1 (en)	1974-10-31
AU447540B2 (en)	1974-03-25
AU477824B2 (en)	1975-07-17
AR195311A1 (en)	1973-09-28
AR210729A1 (en)	1977-09-15